002185 Tianshui Huatian Technology Co.,Ltd.
Closed 08-07 15:00:00
17.98
+0.72
+4.17%
High18.05Low17.12Vol434.95M
Open17.27D1 Closing17.26Amplitude5.39%
Mkt Cap59.75BTradable Cap59.75BTotal Shares3.32B
T/O7.71BT/O Rate13.09%Tradable Shares3.32B
P/B3.2ROE--EPS0.00
52wk High--52wk Low--P/E--
Dividend--Div.Yield--ROA--

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Tianshui Huatian Technology Projects Up to 275% H1 Profit Jump
MT Newswires Live  ·  07-14
Tianshui Huatian Technology Projects Up to 275% H1 Profit Jump
Huatian Technology Anticipates Significant First-Half Profit Surge
Stock News  ·  07-13
Huatian Technology Anticipates Significant First-Half Profit Surge
Tianshui Huatian Technology Sees H1 Net Profit up 231.2%-275.3% Y/Y
Reuters  ·  07-13
Tianshui Huatian Technology Sees H1 Net Profit up 231.2%-275.3% Y/Y
Tianshui Huatian Technology Says No Material Matters to Explain Stock Rally; Shares Up 10%
MT Newswires Live  ·  07-10
Tianshui Huatian Technology Says No Material Matters to Explain Stock Rally; Shares Up 10%
Chip Sector Stocks Surge with Multiple Limit-Ups, Muxi Hits Record High
Deep News  ·  07-09
Chip Sector Stocks Surge with Multiple Limit-Ups, Muxi Hits Record High
Jiangsu HHCK Advanced Materials Shareholder Huatian Technology to Trim Stake
MT Newswires Live  ·  05-25
Jiangsu HHCK Advanced Materials Shareholder Huatian Technology to Trim Stake
Huatian Tech to Construct Integrated Circuit Industrial Base for 3 Billion Yuan; Shares Up 10%
MT Newswires Live  ·  05-25
Huatian Tech to Construct Integrated Circuit Industrial Base for 3 Billion Yuan; Shares Up 10%
Major Shareholder of Jiangsu Hhck Advanced Materials Plans Full Divestment
Stock News  ·  05-24
Major Shareholder of Jiangsu Hhck Advanced Materials Plans Full Divestment
Tianshui Huatian Technology Plans 3 Billion Yuan Investment for Second Phase Expansion of Nanjing IC Advanced Packaging and Testing Base
Stock News  ·  05-22
Tianshui Huatian Technology Plans 3 Billion Yuan Investment for Second Phase Expansion of Nanjing IC Advanced Packaging and Testing Base
Tianshui Huatian Technology Says Unit to Invest 3 Bln Yuan in Integrated Circuit Project
THOMSON REUTERS  ·  05-22
Tianshui Huatian Technology Says Unit to Invest 3 Bln Yuan in Integrated Circuit Project
Advanced Packaging Market Set to Nearly Double by 2026, Reaching $58.7 Billion
Stock News  ·  05-18
Advanced Packaging Market Set to Nearly Double by 2026, Reaching $58.7 Billion
Huatian Technology Turns to Profit in Q1
MT Newswires Live  ·  04-29
Huatian Technology Turns to Profit in Q1
Tianshui Huatian Technology Turns to Profit in Q1 with Net Income of 86.79 Million Yuan
Stock News  ·  04-28
Tianshui Huatian Technology Turns to Profit in Q1 with Net Income of 86.79 Million Yuan
Tianshui Huatian Technology Reports 15.3% Rise in 2025 Net Profit Attributable to Shareholders to 711 Million Yuan, Orders Surge
Stock News  ·  03-31
Tianshui Huatian Technology Reports 15.3% Rise in 2025 Net Profit Attributable to Shareholders to 711 Million Yuan, Orders Surge
A-Share Semiconductor Sector Sees Active M&A Activity Focused on Industrial Synergy and Supply Chain Enhancement
Deep News  ·  02-13
A-Share Semiconductor Sector Sees Active M&A Activity Focused on Industrial Synergy and Supply Chain Enhancement
China's Third-Largest Chip Tester Huatian Tech Proposes 166% Premium Acquisition of Affiliate Assets
Deep News  ·  02-12
China's Third-Largest Chip Tester Huatian Tech Proposes 166% Premium Acquisition of Affiliate Assets
BRIEF-Tianshui Huatian Technology To Buy Huayi Microelectronics For 3.0 Billion Yuan
Reuters  ·  02-10
BRIEF-Tianshui Huatian Technology To Buy Huayi Microelectronics For 3.0 Billion Yuan
Tianshui Huatian Technology Says It Plans to Buy Huayi Microelectronics for 3.0 Bln Yuan via Share Issue, Cash
THOMSON REUTERS  ·  02-10
Tianshui Huatian Technology Says It Plans to Buy Huayi Microelectronics for 3.0 Bln Yuan via Share Issue, Cash

Introduction

Company Name.
天水华天科技股份有限公司
Industry:
计算机、通信和其他电子设备制造业
Listing Date:
2007-11-20
Main Business:
　　天水华天科技股份有限公司的主营业务是集成电路封装测试。公司的主要产品是DIP、SOT、SOP、QFP、QFN/DFN、BGA/LGA、FC、MCM、SiP、WLP、TSV、Bumping、MEMS、FO、PLP、2.5D/3D。公司现已掌握了SiP、FC、TSV、Bumping、FO、WLP、PLP、2.5D/3D等集成电路先进封装技术，承担了多项国家重大科技专项项目（课题），荣获“中国半导体市场值得信赖品牌”、“中国半导体市场最具影响力企业”和“中国十大半导体封装测试企业”等荣誉和称号，多项产品和技术被评为“中国半导体创新产品和技术”。
Issue price:
10.55