Amkor Launches Phase 2 of Arizona Advanced Packaging, Test Campus

Amkor Technology, - Phase 2 Construction to Begin Late 2027, Completion Expected by End of 2029

Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion

Amkor Technology, - Expansion Increases Planned Investment to $12 Bln

Amkor Technology, - Phase 1 and 2 Expected to Support over 3,500 Arizona-Based Employees

SEMICON 2026 Key Takeaways: Advanced Packaging Shifts Toward 3D System Integration, While CPO Manufacturing Faces Testing Hurdles

Amkor Technology put volume heavy and directionally bearish

Semiconductor Sector Faces Crowding Correction; Analysts Flag Fundamental Plays for September

Amkor to Present at Goldman Sachs Communacopia + Technology Conference

AUO Showcases Micro LED Optical Communication and Glass Core Substrates Technologies at SEMICON Taiwan 2026

Amkor Technology Initiated at Buy by B of a Securities

Amkor Technology an Underappreciated Beneficiary of Rising Semiconductor Packaging Complexity, BofA Says

Amkor Technology initiated with a Buy at BofA

Glass Substrates Poised as Key Next-Gen Advanced Packaging Platform, Core Equipment Segments May Reap Initial Gains

Grand Canyon Education’s GCU Plans New College of Law as Enrollment Hits 141,000

US Market Alert: Semiconductor Stocks Tumble as Philly Semiconductor Index Drops Over 3.5%

Huayuan Securities: CPO Poised to Unlock New Growth for Optoelectronic Equipment, Focus on Three Core Investment Themes of Testing, Coupling, and Advanced Packaging

Global OSAT Revenue Surged Roughly 30% in Q2, Advanced Packaging Timelines Pulled Forward, Says Citic Securities

Scaling Limits Drive Chiplet and Advanced Packaging Adoption as Moore's Law Slows

SK Hynix Weighs Selling Majority Stake in $3B China Plant