002185 Tianshui Huatian Technology Co.,Ltd.
Trading 04-01 11:29:36
11.85
+0.21
+1.80%
High12.04Low11.80Vol50.03M
Open11.95D1 Closing11.64Amplitude2.06%
Mkt Cap38.70BTradable Cap38.70BTotal Shares3.27B
T/O596.00MT/O Rate1.53%Tradable Shares3.27B
P/B2.13ROE--EPS0.00
52wk High--52wk Low--P/E--
Dividend--Div.Yield--ROA--

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Tianshui Huatian Technology Reports 15.3% Rise in 2025 Net Profit Attributable to Shareholders to 711 Million Yuan, Orders Surge
Stock News  ·  03-31 01:32
Tianshui Huatian Technology Reports 15.3% Rise in 2025 Net Profit Attributable to Shareholders to 711 Million Yuan, Orders Surge
A-Share Semiconductor Sector Sees Active M&A Activity Focused on Industrial Synergy and Supply Chain Enhancement
Deep News  ·  02-13
A-Share Semiconductor Sector Sees Active M&A Activity Focused on Industrial Synergy and Supply Chain Enhancement
China's Third-Largest Chip Tester Huatian Tech Proposes 166% Premium Acquisition of Affiliate Assets
Deep News  ·  02-12
China's Third-Largest Chip Tester Huatian Tech Proposes 166% Premium Acquisition of Affiliate Assets
BRIEF-Tianshui Huatian Technology To Buy Huayi Microelectronics For 3.0 Billion Yuan
Reuters  ·  02-10
BRIEF-Tianshui Huatian Technology To Buy Huayi Microelectronics For 3.0 Billion Yuan
Tianshui Huatian Technology Says It Plans to Buy Huayi Microelectronics for 3.0 Bln Yuan via Share Issue, Cash
THOMSON REUTERS  ·  02-10
Tianshui Huatian Technology Says It Plans to Buy Huayi Microelectronics for 3.0 Bln Yuan via Share Issue, Cash
Broker Morning Meetings Highlights | Focus on AIDC Power Supply Chain Investment Prospects
Stock News  ·  01-28
Broker Morning Meetings Highlights | Focus on AIDC Power Supply Chain Investment Prospects
Chip Industry Chain Surges Again in Afternoon Session, Huatian Technology Sees Reversal Limit-Up
Deep News  ·  01-27
Chip Industry Chain Surges Again in Afternoon Session, Huatian Technology Sees Reversal Limit-Up
Huahai Chengke Shareholder Huatian Technology Reduces Stake by 1%
Deep News  ·  01-16
Huahai Chengke Shareholder Huatian Technology Reduces Stake by 1%
Huatian Technology: Green Intelligent Manufacturing Leads Sustainable Development in Semiconductors
Deep News  ·  2025-12-23
Huatian Technology: Green Intelligent Manufacturing Leads Sustainable Development in Semiconductors
Jiangsu Hhck Advanced Materials (688535.SH): Tianshui Huatian Technology Plans to Reduce Stake by Up to 1%
Stock News  ·  2025-12-18
Jiangsu Hhck Advanced Materials (688535.SH): Tianshui Huatian Technology Plans to Reduce Stake by Up to 1%
Tianshui Huatian Technology Advances Acquisition of Huayi Microelectronics' 100% Shares and Fundraising Plan
Deep News  ·  2025-11-16
Tianshui Huatian Technology Advances Acquisition of Huayi Microelectronics' 100% Shares and Fundraising Plan
Tianshui Huatian Technology (002185.SZ) Reports Q3 Results with Net Profit Up 51.98% YoY to 543 Million Yuan
Stock News  ·  2025-10-28
Tianshui Huatian Technology (002185.SZ) Reports Q3 Results with Net Profit Up 51.98% YoY to 543 Million Yuan
Tianshui Huatian Technology Co., Ltd. (002185.SZ) Plans Acquisition of Huayi Microelectronics, Resumes Trading on October 17
Stock News  ·  2025-10-16
Tianshui Huatian Technology Co., Ltd. (002185.SZ) Plans Acquisition of Huayi Microelectronics, Resumes Trading on October 17
Tianshui Huatian Technology Co., Ltd. Acquires Semiconductor Company, to Resume Trading Tomorrow
Deep News  ·  2025-10-16
Tianshui Huatian Technology Co., Ltd. Acquires Semiconductor Company, to Resume Trading Tomorrow
Tianshui Huatian Technology Says Trading in Shares to Resume October 17
THOMSON REUTERS  ·  2025-10-16
Tianshui Huatian Technology Says Trading in Shares to Resume October 17
BRIEF-Tianshui Huatian Technology's Share Trade To Resume October 17
Reuters  ·  2025-10-16
BRIEF-Tianshui Huatian Technology's Share Trade To Resume October 17

Introduction

Company Name.
天水华天科技股份有限公司
Industry:
计算机、通信和其他电子设备制造业
Listing Date:
2007-11-20
Main Business:
　　天水华天科技股份有限公司的主营业务是集成电路封装测试。公司的主要产品是DIP、SOT、SOP、QFP、QFN/DFN、BGA/LGA、FC、MCM、SiP、WLP、TSV、Bumping、MEMS、FO、PLP、2.5D/3D。公司现已掌握了SiP、FC、TSV、Bumping、FO、WLP、PLP、2.5D/3D等集成电路先进封装技术，承担了多项国家重大科技专项项目（课题），荣获“中国半导体市场值得信赖品牌”、“中国半导体市场最具影响力企业”和“中国十大半导体封装测试企业”等荣誉和称号，多项产品和技术被评为“中国半导体创新产品和技术”。
Issue price:
10.55