Shengyi Electronics Co., Ltd. (688183.SH) disclosed its 2025 private placement plan for A-shares. The company intends to issue shares to no more than 35 specific investors at a price not lower than 80% of the average trading price over the 20 trading days prior to the pricing benchmark date, which will be the first day of the issuance period.
The number of shares to be issued will be determined by dividing the total fundraising amount by the issuance price, with the total not exceeding 15% of the company's pre-issuance share capital—capped at 125 million shares (inclusive).
The private placement aims to raise up to 2.6 billion yuan (inclusive), with net proceeds after deducting issuance expenses allocated to the following projects: 1. Construction of an AI computing HDI production base 2. Smart manufacturing high-layer computing circuit board project 3. Working capital replenishment and bank loan repayment.
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