Shengyi Electronics Co.,Ltd. (688183.SH) Plans to Invest Approximately 1.9 Billion Yuan in Smart Manufacturing High Multi-Layer Computing Circuit Board Project

Shengyi Electronics Co.,Ltd. (688183.SH) announced that following the company's new strategic planning and comprehensive research and assessment of internal and external demand, the company's board of directors approved an investment in a smart manufacturing high multi-layer computing circuit board project during the 30th meeting of the third board of directors held on August 14, 2025. The project will be located on partial floors of existing factory buildings in the Ji'an Phase II project.

The project has a planned total investment of approximately 1.9 billion yuan, including but not limited to public facilities, production equipment, testing equipment and other related investments. This includes factory construction and equipment costs already invested in corresponding floors of the Ji'an Phase II project. The company will implement the project in phases based on market demand and business progress.

The project will be implemented by the company's wholly-owned subsidiary, Ji'an Shengyi Electronics Co., Ltd., and is located in Jinggangshan Economic and Technological Development Zone, Ji'an City, Jiangxi Province. The total investment amount is approximately 1.9 billion yuan, including factory construction and equipment costs already invested in corresponding floors of the Ji'an Phase II project, with new investment of approximately 1.75 billion yuan.

The project is planned for two-phase implementation with a total construction period of 2.5 years. Phase I is expected to begin trial production in 2026, while Phase II is expected to begin trial production in 2027.

The project focuses on smart manufacturing high multi-layer computing circuit boards, aiming to meet the demands of mid-to-high-end markets including servers, high multi-layer network communications, and rapidly developing AI computing applications. In terms of production capacity planning, the project plans annual production of 700,000 square meters of printed circuit boards, with each phase producing 350,000 square meters annually.

The advancement of this project will benefit the company's resource integration and production capacity layout optimization, better aligning with market demand growth trends.