Samsung Electronics Initiates Global Sample Shipments of HBM4E Chips

Deep News05-29

Samsung Electronics Co., Ltd. announced on Friday that it has commenced sample deliveries of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, claiming it to be the first product of its kind shipped globally. As demand for high-end memory chips from AI servers and processors surges, leading artificial intelligence companies including AMD, NVIDIA, and Google are among Samsung's clients.

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