Recently, the construction of Piotech Inc.'s high-end semiconductor equipment industrialization base, located in the Intelligent Manufacturing Industrial Park in Shenyang's Hunnan District, has entered a critical final stage for the main structures. Work is progressing efficiently in both the northern and southern zones, with a strong push towards completing the mechanical and electrical installation phase. This project is a practical effort to accelerate the national strategy for domestic semiconductor equipment.
With a total investment of 2 billion yuan, the project covers a total floor area of 156,000 square meters. It includes two core functional areas: a research and development center and cleanroom production facilities. This project is a benchmark initiative for the domestic production of key national semiconductor equipment and a major supporting project for Hunnan District's efforts to promote semiconductor industry cluster development and build a modern industrial system.
Entering May, the construction site is bustling with numerous tower cranes and the sound of machinery. Hundreds of workers are distributed across various work areas, carrying out construction in an orderly manner. In the northern zone, the main structure of Plant #4 is complete, and roof layer construction for Plant #3 is 80% finished. In the southern zone, steel structure installation for Plant #1 and foundation work for Dormitory Building #2 are steadily advancing. All construction processes are efficiently coordinated, demonstrating a full-capacity, fast-paced building effort.
According to the plan, the project aims to achieve full structural topping-out by mid-July. Enclosure with curtain walls is scheduled for completion by the end of this year, laying a solid foundation for interior finishing and landscape construction in 2027. The entire project is expected to be completed and delivered by the end of 2027.
As a carrier for the research, development, and production of core chip manufacturing equipment, the completed project will focus on the R&D and industrialization of globally leading thin-film deposition equipment such as PECVD, SACVD, and HDPCVD. It aims to comprehensively address the capacity shortfall in domestic high-end equipment, significantly enhance China's self-sufficiency in chip manufacturing equipment supply, and inject strong momentum into the autonomy and control of the semiconductor industry chain and supply chain.
Regarding capacity upgrade, upon operation, the project will increase the production capacity in the Shenyang area to four times the current level. This will fully support the industrialization of high-end thin-film products and drive the continuous growth of the company's business scale. Simultaneously, the project is expected to attract nearly 3,000 high-end technical professionals to Shenyang, further strengthening the high-end industrial talent pool in Hunnan District and providing solid intellectual support for the high-quality development of the regional industry.
In recent years, Hunnan District has leveraged major projects to continuously optimize the industrial ecosystem and improve service efficiency, vigorously promoting the cluster development of key industries such as high-end equipment manufacturing and semiconductors. The accelerated construction of the Piotech industrialization base will further refine Shenyang's semiconductor industry layout, drive synergistic development of upstream and downstream industries, and contribute core strength to Shenyang's industrial transformation and upgrading, as well as to achieving new breakthroughs in the comprehensive revitalization of Northeast China.
From May 15th to 17th, the "2026 Advanced Semiconductor Packaging Technology and Application Forum (CASPF 2026)" will commence in Jiangyin. The forum will focus on advanced semiconductor packaging technology, offering a comprehensive exploration of cutting-edge trends in advanced semiconductor materials, devices, processes, equipment, and applications. Numerous industry chain experts, representatives from universities, research institutes, and well-known enterprises will gather to discuss the latest advancements in packaging technology. Industry peers are cordially invited to Jiangyin for this premier event in the advanced packaging field, to jointly explore the path of innovation in advanced packaging materials and discuss the promising future of the semiconductor industry.
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