In January 2026, the number of global investment projects related to printed circuit boards (PCB) experienced a year-on-year decrease. Domestically, the number of investment projects in January remained at the same level as the same period last year. As shown in Figure 1, as of the end of January 2026, there were a total of 229 investment projects (including those under construction) by domestic PCB enterprises, with four new projects added in January. These included two new signed agreements and two capital increase projects. The newly added investment amount in January (only including disclosed figures) was approximately 4.32 billion Chinese yuan. Key projects involved Wus Printed Circuit Co., Ltd. signing a 2.05 billion yuan agreement in Changzhou, Jiangsu for a high-density optoelectronic integrated circuit board project; Yilian Technology planning to invest 1.2 billion yuan to expand its flexible printed circuit (FPC) project; Dongshan Precision increasing capital to its subsidiary Yanchang Weisheng; and Jiangsu Puneng signing an agreement in Kunshan, Jiangsu for an end-side functional integrated circuit (IC) substrate project. One additional investment project was categorized under other types, with a disclosed investment amount of about 4.5 billion yuan, specifically referring to Shengyi Technology's high-performance copper-clad laminate project signed in Dongguan, Guangdong.
Figure 1: New Domestic PCB-Related Investment Projects in January 2026
Table 1: New Domestic PCB and Related Investment Projects in January 2026
Internationally, the overall number of investment projects in January decreased compared to the same period last year. As illustrated in Figure 2, seven new PCB-related international investment projects were recorded in January 2026, a decline from January of the previous year. These projects were located in Thailand, South Korea, Taiwan China, Singapore, and Malaysia, with a total disclosed investment amount of 3.91 billion Chinese yuan. Notable activities included Chaoyang Electronic adjusting its expansion plan for high-end AI computing power PCB production in Thailand; Taiwan Union Technology announcing land acquisition for a new factory construction; Dynamic Electronics holding increasing capital to its Thailand facility; and Ya Hua intending to inject additional funds into its Thailand plant.
Figure 2: New International PCB-Related Investment Projects in January 2026
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