Huizhou Desay Sv Automotive Co.,Ltd. (Desay SV) was invited to attend the 2026 Qualcomm Automotive Technology and Collaboration Summit held in Wuxi on June 4-5.
The company, alongside Qualcomm and other global industry chain partners, jointly launched the Claw ecosystem plan for automotive artificial intelligence, aiming to build a more open and collaborative AI Agent ecosystem.
During the summit, Zhao Caizhi, Director of Innovation Technology Research, and Zhang Gong, Chief Engineer of the Intelligent Driving Business Unit at Desay SV, delivered speeches.
They systematically showcased the company's achievements in vehicle electronic and electrical architecture technology and intelligent cockpit-driver co-evolution in the AI era, as well as the deep integration synergy between Desay SV's full-stack technology base and the Qualcomm chip platform.
Full-Stack Technology Foundation for Defining Evolvable Super AI Agents
The deep integration of AI large models and edge-side computing power is transforming the smart cockpit from a passive functional carrier into an active intelligent partner, shifting the industry from "software-defined vehicles" to "AI-defined vehicles."
Leveraging its full-stack capabilities in computing platform design and production, system middleware development, AI agent distillation applications, AIOS development, and HMI solution design, Desay SV has established a complete technical closed-loop from underlying hardware to upper-layer applications.
Zhao Caizhi, Director of Innovation Technology Research at Desay SV, stated, "With the maturation of technologies like AI intelligent resource allocation and software architecture automatic evolution, intelligent connected vehicles based on EEA4.0 will ultimately evolve into self-evolving super AI agents."
Based on this closed-loop capability, Desay SV has introduced a series of EEA platform product solutions for AI-defined vehicles, including a central computing platform - cloud-edge integrated AI cockpit solution and a vehicle tool platform - SOA development tools, providing OEMs with efficient and flexible customization options.
Zhao Caizhi pointed out that as technologies like AI intelligent resource allocation mature, vehicles will evolve into autonomous super agents, helping automakers seize opportunities in an increasingly competitive market.
Creating a New-Generation Smart Car Experience with Single-Chip Dual Intelligence
As a long-term strategic partner of Qualcomm in the field of intelligence, Desay SV has continued to deepen its efforts in cockpit-driver integration.
Collaborating with Qualcomm, the company has consistently led industry technological innovation from smart cockpit and intelligent driving to cross-domain fusion and central computing.
Zhang Gong noted in his speech that through the deep three-dimensional integration of system, algorithm, and chip, Desay SV has successfully realized product achievements featuring "single-chip dual intelligence, excellence in both cockpit and driving."
Relying on its self-developed fusion architecture, Desay SV assists automakers in upgrading their hardware systems.
Customized cockpit-driver fusion algorithms significantly enhance vehicle adaptability.
The single-chip cockpit-driver solutions, deeply optimized based on the Qualcomm 8775 and 8797 platforms, are progressing well, with the 8775 platform nearing mass production and the 8797 platform technology maturing.
The synergy of these three capabilities comprehensively elevates the overall intelligence level of vehicles.
Zhang Gong, Chief Engineer of the Intelligent Driving Business Unit at Desay SV, emphasized, "Through the deep three-dimensional integration of system, algorithm, and chip, Desay SV has successfully realized product achievements featuring 'single-chip dual intelligence, excellence in both cockpit and driving.'"
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