HTSC has announced details for its 2026 Science and Technology Innovation Corporate Bond, which is the first tranche of the offering aimed at professional investors.
The bond issued by Huatai Securities Co., Ltd. carries a two-year term.
On July 13, 2026, the issuer and the lead underwriter conducted a book-building process with professional institutional investors to determine the coupon rate.
Based on the results of this offline inquiry and following mutual agreement between the issuer and the lead underwriter, the final coupon rate for this bond issue has been set at 1.56%.
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