On the afternoon of September 26th, Zhejiang Jingsheng Mechanical&Electrical Co.,Ltd. (300316) experienced a significant stock price rally, surging over 15% intraday and reaching a new yearly high.
On the news front, the company's official social media account announced at midday that on September 26th, the first 12-inch silicon carbide substrate processing pilot production line was officially commissioned at Zhejiang Jingrui SuperSiC, a subsidiary of Zhejiang Jingsheng Mechanical&Electrical Co.,Ltd. This milestone marks that Zhejiang Jingrui SuperSiC has truly achieved complete autonomous R&D capabilities across the entire production chain from crystal growth, processing to testing, with 100% domestic production. This signifies that Jingsheng is advancing from keeping pace to leading in global SiC substrate technology, entering a new phase of high-efficiency intelligent manufacturing.
Driven by this silicon carbide concept leader, other related stocks also showed unusual trading activity, including Jingsheng Shares, Sicc Advanced Materials, and Luxshare Precision Industry.
According to media reports, with the development of artificial intelligence (AI) technology, the performance of GPU chips used in AI servers continues to improve, leading to constantly increasing chip power consumption. Meanwhile, to reduce chip volume and area, advanced packaging has adopted high-density stacking methods for multiple chips (such as CoWoS), resulting in increasingly severe heat dissipation challenges for chip packaging. Traditional ceramic substrates have thermal conductivity of approximately 200W/mK-230W/mK, which can no longer meet the growing heat dissipation demands.
Silicon carbide materials happen to possess excellent thermal conductivity properties. Public data shows that silicon carbide's thermal conductivity is second only to diamond, reaching 400W/mK and even approaching 500W/mK, nearly twice that of ceramic substrates, making it an excellent packaging material for data centers and high-performance AI chips.
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