Samsung Unveils Next-Generation HBM4E AI Chip at NVIDIA GTC Conference

Deep News07:32

Samsung Electronics introduced the new chip for the first time at the NVIDIA GTC conference, highlighting its efforts to become a key partner for NVIDIA's upcoming Vera Rubin platform. Samsung also showcased Hybrid Copper Bonding, a new packaging technology designed to overcome the physical limitations of conventional thermal compression bonding. The HCB technology enables next-generation high-bandwidth memory to achieve stacking of 16 layers or more while reducing thermal resistance by over 20%. Other cutting-edge technologies developed for NVIDIA's AI infrastructure include HBM4 and SOCAMM2, both of which are already in mass production.

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