On September 12, Xiamen Bank Co.,Ltd. announced that, with approval from the People's Bank of China, the bank has successfully issued "Xiamen Bank Co.,Ltd. 2025 First Tranche Technology Innovation Bonds" (hereinafter referred to as "the bonds") in the national interbank bond market.
The bonds underwent book-building on September 10, 2025, and completed issuance on September 12, 2025, with a total issuance size of RMB 1 billion. The bonds are 5-year fixed-rate instruments with a coupon rate of 1.90%.
Xiamen Bank Co.,Ltd. stated that the proceeds from this bond issuance will be directed toward technology and innovation sectors as specified in the "Overall Statistical System for Financial 'Five Major Articles' (Trial)," including issuing technology loans and investing in bonds issued by technology innovation enterprises, specifically supporting business operations in the technology innovation sector.
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