Advanced Micro-Fabrication Equipment Inc. China (AMEC) announced that its wholly-owned subsidiary, Advanced Micro-Fabrication Equipment (Shanghai) Co., Ltd. ("AMEC Lingang"), plans to invest no more than 35 million yuan in Qinghe Chip Semiconductor Technology (Group) Co., Ltd. ("Qinghe Chip") through a capital increase.
AMEC Lingang will subscribe to 9,042 yuan of Qinghe Chip's newly registered capital, representing a 0.5000% stake in Qinghe Chip's post-financing registered capital.
In this round, AMEC Lingang, along with seventeen other investors, plans to inject a total of 250 million yuan into Qinghe Chip, raising the company's registered capital from 1.743799 million yuan to 1.808385 million yuan.
Together with equity acquired from previous capital increases, AMEC Lingang will hold a total of 7.0718% of Qinghe Chip's registered capital after this round.
Qinghe Chip positions itself as a provider of advanced semiconductor bonding integration technology and solutions, with core operations built on "high-end bonding equipment manufacturing plus full-line services." Its products mainly include wafer bonding equipment, chip bonding equipment, and surface treatment equipment.
These technologies are widely used in advanced packaging, semiconductor device manufacturing, wafer-level heterogeneous material integration, and MEMS sensors, with the company committed to building full-industry-chain solutions.
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