Two government departments have initiated a pilot program for bonded testing operations outside of comprehensive bonded zones.
This initiative aims to optimize bonded supervision systems and foster the integrated development of trade in services with high-end manufacturing. The pilot will focus on bonded testing for integrated circuits and consumer electronics, which involve a "two ends abroad" business model.
The scope of the pilot has been clearly defined. For integrated circuits, testing refers to the verification and examination of electrical parameters, functional logic, physical characteristics, and reliability of newly developed or produced chips (including wafers) during the stages of chip R&D, wafer manufacturing, and final packaging. This is to confirm that the quality and performance of the chip products meet standards during the design, manufacturing, and application phases. For consumer electronics, testing involves the examination and verification of the safety, performance indicators, compatibility, and reliability of newly produced consumer electronic products and their components, based on international, national, or industry standards.
The notification also outlines the application requirements and procedures for participating in the pilot program, and sets forth requirements for improving the regulatory mechanism.
An expert noted that this pilot program, by concentrating on bonded testing for high-value-added goods like integrated circuits and consumer electronics outside comprehensive bonded zones, can leverage the advantages and capabilities China has gradually developed in these sectors. It also aims to amplify the radiating and driving effect of China's high-end manufacturing industry on trade in services.
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