Shihe Gene, Shiweitong, and Weijia Technology's STAR Market IPO Applications Enter Inquiry Phase

Stock News07-23

The Shanghai Stock Exchange's official website shows that the IPO review status for Shihe Gene, Shiweitong, and Weijia Technology has been updated to "inquiry."

According to the prospectus, Shihe Gene is a high-tech enterprise dedicated to the clinical application of high-throughput gene sequencing technology, primarily providing gene testing services for cancer patients. The company aims to guide clinical medication selection, identify drug resistance mechanisms, and monitor postoperative recurrence by clarifying genetic profiles. It also explores early screening and diagnosis for at-risk populations, offering molecular diagnostic services and products for precision oncology medicine. By the end of the reporting period, the company had four approved products and nine core pipeline projects under development. It is currently the only company in the domestic gene testing industry to have been selected four times for the Innovative Medical Device Special Review Program.

Shiweitong is a national-level specialized and sophisticated enterprise focusing on the R&D and production of optoelectronic devices and sensors. Its main products include optoelectronic integrated devices and components, as well as fiber-optic current sensors for strong electromagnetic environments. The Y-waveguide modulator is a primary product within the company's optoelectronic integrated devices and components lineup.

Weijia Technology is committed to the R&D, manufacturing, and sales of key equipment in the electronic packaging field. Its product portfolio includes specialized PCB equipment and integrated circuit packaging and testing equipment. The company has established a multi-level, multi-system product layout covering board-level packaging (Level-2 packaging) and component-level packaging (Level-1 packaging), and is gradually extending into chip-level packaging (Level-0 packaging). Its products are widely used in core manufacturing processes for high-density printed circuit boards, integrated circuits, and other electronic components, with end applications covering strategic emerging industries such as artificial intelligence, AI computing power, data centers, and 5G/6G communication.

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