SHANGHAI FUDAN (01385) announced that on May 11, 2026 (after trading hours), the company, Fudan University, and Guosheng Investment entered into a cooperation agreement for the joint establishment of the Fudan University Integrated Circuit Engineering Technology Integration and Innovation Center. The company agreed to jointly establish an integrated circuit technology center with Fudan University to collaborate on research, development, and technological breakthroughs in cutting-edge areas of integrated circuits.
The collaborative R&D projects are driven by major national economic construction and development needs, closely tracking international advanced technological frontiers such as FPGA, intelligent computing, and new memory technologies. The aim is to break through the engineering technology bottlenecks of high-end FPGA EDA, promote innovation in domestic high-end FPGA architecture design and hardware platform technology, and create a combination of domestic high-end FPGA software and hardware technology platforms. This initiative fundamentally addresses the critical challenge of dependence on imported high-end FPGAs, enhances China's independent innovation capability and international competitiveness in domestic high-end FPGA chips, intelligent computing, and high-reliability storage, thereby meeting the nation's major strategic requirements.
The company will pay a total startup fee of RMB 20 million for the integrated circuit technology center. The startup funds will be used for purposes including, but not limited to, one-time expenses for talent recruitment, R&D platform construction (instruments, equipment, software, etc.), venue rental, venue renovation, various consumable costs, as well as electricity, fuel, and water fees. During the cooperation period, the company plans to provide up to RMB 10 billion in collaborative funding to the center.
Within sixty months from the effective date of this agreement, the integrated circuit technology center will focus on the company's business strategy and product planning to develop R&D platforms for IP technologies including, but not limited to, ultra-high-speed transceivers, ultra-high-bandwidth radio frequency direct sampling analog-to-digital/digital-to-analog converters, network acceleration, PCIe5, and multi-rate Ethernet. It will also undertake the overall architecture design of next-generation FPGAs and conduct research on core technologies and architectural innovations for artificial intelligence heterogeneous chips.
The company is responsible for proposing forward-looking scientific and technical problems to be solved. Both parties will sign specific technology development agreements based on the topics proposed by the company, clarifying R&D objectives, funding, and deliverables through these agreements. R&D expenses will be implemented according to the plans stipulated in the technology development agreements, covering items including, but not limited to, salaries for dedicated R&D personnel, labor costs for students and/or experts, and investments in customized equipment.
Fudan University will apply for national or provincial/ministerial-level key R&D projects on behalf of the center for the specific collaborative R&D projects jointly determined by both parties and strive to obtain various planned project funds from government fiscal appropriations for use in the collaborative R&D.
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