On October 30, Taiwan Semiconductor Manufacturing fell 3.68% in Regular Trading, trading at USD 416.25, with turnover of USD 806 million.
The move coincided with market attention on the company’s planned NTD 14.8 billion corporate bond issuance, while investor conviction around a reported 10% to 20% potential increase in CoWoS advanced packaging prices turned more cautious, shifting focus toward pullback risk after earlier gains.
Additional context showed the company had disclosed a NTD 38.8 billion purchase of a Taichung plant and related facilities, underscoring ongoing capital spending. In options trading, a USD 1.54 million purchase of January 2027 USD 370 strike put options pointed to defensive, moderately bearish positioning by some large investors.
(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)
Comments