At Intel's wafer fab in the suburbs of Portland, Oregon, several machines bearing the logo of ACM Research (盛美半导体) are undergoing final adjustments. These wet etching tools from China not only carry Intel's hopes for mass production of its 14A (1.4nm-class) advanced node but are quietly shattering a long-held industry perception—that Chinese semiconductor equipment is only suitable for mature processes. As Chinese technology reaches the core of global cutting-edge chip manufacturing, a silent yet profound industry restructuring is unfolding across the semiconductor landscape.
**Technological Breakthrough: The "Entry Ticket" of Nitrogen Bubble Technology** Intel's 14A process ambition has always aimed for industry leadership. Scheduled for mass production in 2027, this cutting-edge technology integrates High-NA EUV lithography and second-generation PowerVia backside power delivery, targeting transistor density and energy efficiency surpassing TSMC's 2nm process. However, advanced technology comes with challenges—as chip line widths shrink to nanometer scales, issues like byproduct deposition and etching uniformity in high-aspect-ratio structures become critical yield bottlenecks.
ACM Research's inclusion in Intel's testing list stems from its patented nitrogen (N₂) bubble technology. According to ACM Shanghai's July 2025 disclosure, its upgraded Ultra C wb wet cleaning tool improves wafer-to-wafer etching uniformity by over 50% while effectively addressing secondary deposition issues in traditional phosphoric acid cleaning.
The breakthrough lies in its innovative physical mechanism. Conventional wet etching struggles with fluid dynamics in nanostructures, leading to byproduct buildup. ACM's nitrogen bubble technology generates uniform, controllable microbubbles that create microflows to remove byproducts and prevent structural collapse—crucial for 3D NAND and advanced logic chips.
For Intel, this aligns perfectly with 14A's 3D logic device needs, where PowerVia's precision demands nanometer-level etching control. ACM's equipment has passed three advanced process validations, including stacked silicon nitride and tungsten gate etching, matching top-tier international tools in performance.
Competitive data further solidifies its edge. ACM executives confirmed delivery of three test units to a leading U.S. semiconductor firm, with key metrics meeting targets. Its particle removal rate handles organic residues from specialty phosphoric additives, while compatibility spans multiple chemistries. Cost advantages stand out—batch processing reduces chemical consumption and boosts efficiency, a critical factor for Intel amid High-NA EUV's soaring expenses.
**Intel's "Dual Dilemma" and Supply Chain Reshaping** Intel's testing of ACM equipment reflects a survival-driven strategic bet. CEO Pat Gelsinger's foundry overhaul prioritizes 14A over 18A, targeting clients like Microsoft and NVIDIA by 2027. Yet challenges loom: billions spent on 18A R&D risk write-offs if 14A lags, while delayed CHIPS Act subsidies strain its $30B fab investments.
Diversification becomes key. Long reliant on Applied Materials and Tokyo Electron (80% wet tool market share), Intel faces pricing pressure and geopolitical supply risks. ACM offers not just cost efficiency but supply chain resilience.
Globally, ACM ranks fourth in wet tools and third in plating, with an IP portfolio avoiding litigation. Intel VP John Pitzer noted 14A's faster progress versus 18A, partly due to efficient equipment testing. ACM's U.S. HQ and Korean R&D base provide a "China-tech, global-manufacturing, local-service" model easing geopolitical compliance.
However, policy risks persist. The proposed CHIP EQUIP Act bars subsidized projects from using "foreign entity of concern" equipment. While ACM delivers via its U.S. arm, its Shanghai entity's inclusion on the Entity List sparks debates over core tech origins and remote-control risks—highlighting Washington's conflict between fostering domestic capacity and curbing China's progress.
**Industry Shockwaves: Domestic Tools' Global Ascent** ACM's 14A entry marks Chinese equipment's historic leap from mature to advanced nodes, debunking the myth of being confined to 28nm+. This stems from decades of specialization—ACM, founded in 2005 by 30-year veteran Dr. Wang Hui, expanded from cleaning to plating and packaging via differentiated tech. Its global playbook—U.S. HQ, Korean production, and 15%+ revenue R&D—built patent moats and client-driven iterations.
Its focused strategy—avoiding broad competition but innovating in niches like wet etching—offers a template for peers like AMEC and NAURA. Even segment breakthroughs can reshape supply chains: if ACM passes testing, Applied Materials and TEL's wet tool duopoly may face price and innovation pressures.
Rivals are watching. Samsung eyes ACM for 3D NAND lines, while TSMC, despite public confidence in 2nm, internally explores cost-cutting via supplier diversification.
**Geopolitical Tug-of-War: Tech Flow vs. Controls** ACM's case exposes semiconductor geopolitics' contradictions—the U.S. funds domestic production via the $52.7B CHIPS Act yet restricts China's tech access. ACM's hybrid model (U.S. compliance + Chinese tech) shows barriers can't fully halt know-how diffusion, especially in chemistry-driven fields like wet etching.
Policymakers face dilemmas: strict controls may stifle innovation, while limited collaboration could accelerate China's advances. The CHIP EQUIP Act's diluted restrictions after industry lobbying reflect this tension.
Broader trends suggest "techno-nationalism" clashes with globalization's efficiency. Full decoupling is impractical; instead, "managed diversification"—backup capacity in critical areas with open collaboration elsewhere—may emerge.
**Future Outlook** Regardless of outcomes, ACM-Intel collaboration already reshapes perceptions: Chinese firms can compete in cutting-edge tools, potentially inspiring more R&D and segment breakthroughs.
Diversification may lower advanced-node costs—ACM's tools could trim Intel's 14A capex by 10-15%, pivotal in $100B-scale investments.
Geopolitically, pure export controls risk pushing China toward self-reliance, bifurcating tech ecosystems and slowing global innovation.
Ultimately, ACM's rise signals China's shift from follower to peer—even leader—in select domains. This isn't zero-sum; competition and cooperation can propel the entire industry forward.
**Epilogue: Balancing Openness and Security** As ACM's tools undergo final tests in Oregon, each parameter met redraws industry boundaries. This cross-Pacific tech partnership mirrors Moore's Law's innovative imperative and geopolitics' disruptive weight.
At the 1.4nm threshold, the semiconductor world faces a choice: walled-off stagnation or open competition. ACM and Intel suggest breakthroughs ultimately transcend short-term rivalries.
Like Moore's Law thriving on innovation, not barriers, the industry's future hinges on dynamic equilibrium—security with openness, competition with collaboration. ACM's story, just beginning, underscores a truth: in global tech networks, no single player monopolizes progress. Only IP-respecting, rule-based cooperation can sustain semiconductors' foundational role in powering the digital economy—a lesson resonating far beyond 1.4nm's technical triumph.
Comments