Apple's Most Dense Chip Interconnect Yet: M6 Pro / Max Development Continues with TSMC's First Dual-Packaging Strategy

A fresh report from Commercial Times on Tuesday suggests that Apple may not be shelving development of its M6 Pro and M6 Max processors after all.

Earlier reports citing Mark Gurman indicated that Apple was restructuring its M6 and M7 chip roadmap, potentially bypassing the M6 Pro and M6 Max in favor of prioritizing the AI-focused M7 series. However, the latest intelligence reveals that Apple is still actively advancing both the M6 Pro and M6 Max, which are expected to leverage advanced packaging technologies such as SoIC-MH and WMCM (wafer-level multi-chip module).

These cutting-edge techniques are set to deliver what would be the highest interconnect density and most intricate packaging architecture in Apple's chipmaking history. Interconnect density refers to the number or tightness of wires and contacts linking transistors and circuit components within a given area or volume.

To achieve this leap in performance, sources indicate that Apple will, for the first time, adopt a dual-packaging combination from Taiwan Semiconductor Manufacturing. By integrating both horizontal and vertical 3D packaging modes, this approach can effectively reduce power consumption while completely eliminating signal distortion caused by long-distance routing.