Shanghai Bangxin Semiconductor Technology Co., Ltd. has completed a Series B+ funding round totaling more than RMB 600 million, with Jiangxia Science and Technology Investment Group serving as the lead investor, according to a report.
The round also saw participation from institutions including Bank of China Capital and Yangtze River Venture Capital. The proceeds will be primarily directed toward research and development of advanced-process equipment, production capacity expansion, and the construction of a delivery system in the Central China region.
Public records show that Bangxin Semiconductor was established in January 2020 and is headquartered in the Lin-gang Special Area of Shanghai. The company focuses on the development and localization of semiconductor front-end equipment, with products covering key process areas such as etching, photoresist stripping, and thin-film deposition.
It has launched multiple 6-inch, 8-inch, and 12-inch equipment models, which have passed validation by mainstream memory manufacturers and first-tier wafer fabs and achieved volume installation. In 2025, the company delivered more than 100 units of equipment.
Company Chairman Wang Zhaoxiang holds a doctorate in physical chemistry from the University of Science and Technology of China, and the core team comes from leading domestic semiconductor equipment enterprises.
In April of this year, Wuhan Bangxin broke ground at the Jiangxia Intelligent Manufacturing Industrial Park. On October 28, the first phase of its Central China production base, spanning over 4,500 square meters, was put into operation. Once fully ramped up, it is planned to have an annual production capacity of 100 semiconductor equipment units.
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