消息称台积电正考虑在美国建造首家芯片封装工厂

新浪科技2021-06-11

北京时间6月11日晚间消息，据报道，台积电正考虑在美国再建一家先进半导体制造工厂。此举也旨在响应美国政府将更多科技供应链带入本土的愿望。 报道称，该新工厂将进行芯片封装，使用先进技术将不同类型的半导体集成到晶片上。这将是台积电在本土市场以外的第一个此类设施。 当前，台积电已经在亚利桑那州凤凰城建设其在美国的第一家芯片制造厂，预计投资120亿美元，于2024年投产。该工厂将生产5纳米芯片，也是目前最...

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Comments

  • 狐假虎威85
    2021-06-11
    狐假虎威85
    666
  • Choolin
    2021-06-11
    Choolin
    還欠一個回覆就完成任務，幫幫忙吧！
    • JuXian: 
      可以的话帮我把我的评论点击成精华评论吧 哈哈
    • Choolin: 
      就等一个回复，谢谢啦
    • JuXian: 
      什么任务呢
    • Choolin: 
      谢啦谢啦
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