Tianshui Huatian Technology Co.,Ltd. recently announced plans to integrate its three core business segments - Huatian Jiangsu, Huatian Kunshan, and Huatian Advanced No.1 Fund - to jointly establish Nanjing Huatian Advanced Packaging Co., Ltd. in Pukou Economic Development Zone, with a registered capital of 2 billion yuan.
The global advanced packaging market is currently experiencing explosive growth, with international giants including TSMC, Intel, and Samsung significantly increasing their investments. Facing intense competition, Tianshui Huatian Technology is responding with a robust "cash + heavy assets" investment approach. Huatian Jiangsu contributes land, property, and machinery equipment to provide a solid asset foundation for the project, while Huatian Kunshan and Advanced No.1 Fund provide cash support. The three segments form a strategic "technology + capital + assets" triangle, creating a powerful force in this computing power arms race.
Industry forecasts indicate that by 2027, advanced packaging will account for a larger market share than traditional packaging for the first time. Facing this critical inflection point, Tianshui Huatian Technology's 2 billion yuan investment in establishing Huatian Advanced will not only create new business growth opportunities for the company but also generate positive impacts across the entire semiconductor assembly and testing industry. As Huatian Advanced develops and expands, it is expected to drive progress in domestic 2.5D/3D advanced packaging and testing technologies, promoting industry upgrading and enhancing the overall competitiveness of China's semiconductor industry.
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