Anji Microelectronics Details Comprehensive Chemical Mechanical Polishing Product Portfolio

Deep News03-17 22:11

Anji Microelectronics announced on March 17th, in response to investor inquiries on an interactive platform, that its chemical mechanical polishing (CMP) slurry products encompass multiple platforms. These include copper and copper barrier slurries, dielectric material slurries, tungsten slurries, slurries based on ceria abrasives, and substrate slurries. CMP slurries are composed of nanoscale abrasive particles and high-purity chemicals.

The company ensures supply chain security and long-term cost control by continuously advancing the independent research, development, and production of core raw materials. Regarding pricing, the company determines its prices based on factors such as product cost, R&D expenses, customer requirements, and market conditions.

Anji Microelectronics' primary business focuses on the research, development, and commercialization of critical semiconductor materials. Its products are widely used in integrated circuit manufacturing and advanced packaging sectors. The company holds a position as a mainstream supplier in the domestic market and is actively strengthening its overseas market presence to meet the technological and commercialization needs of wafer fabrication and advanced packaging clients globally.

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