On March 25, SEMICON China 2026 opened in Shanghai. During the exhibition, several domestic semiconductor equipment manufacturers introduced new products. Advanced Micro-Fabrication Equipment Inc. China (AMEC) announced the launch of four new products covering key processes for silicon-based and compound semiconductors. These include the new-generation inductively coupled plasma (ICP) etching system Primo Angnova™, the high-selectivity etcher Primo Domingo™, the Smart RF Match intelligent radio frequency matcher, and the Preciomo Udx MOCVD system for mass production of blue and green Micro LEDs.
The Smart RF Match intelligent RF matcher released by AMEC is designed to achieve stable plasma generation and control within the equipment chamber. It is specifically developed for front-end semiconductor processes, particularly dielectric etching, silicon etching, metal etching, as well as applications in advanced packaging, MEMS, and compound semiconductor precision etching. This product is the first in the semiconductor equipment industry to introduce the concept of a dedicated RF loop network. By utilizing EtherCAT, it enables real-time and accurate transmission of RF status information between the RF power supply and the intelligent matcher, allowing the matcher to function as an active device that issues control commands to the RF power supply while adjusting the matching network.
The Preciomo Udx MOCVD system, a key tool for Micro LED mass production, was launched by AMEC to meet the stringent requirements for high wavelength uniformity and low particle levels. The equipment incorporates entirely new design concepts in key technologies such as gas transport, heating modes, and temperature field control. It breaks away from the existing vertical flow MOCVD technical route by adopting a novel horizontal dual-rotation reaction chamber structure. Through simulation-based design of temperature and flow fields, along with hardware and process optimization, it significantly improves wavelength uniformity, providing critical support for customers aiming to achieve mass production of Micro LEDs.
Additionally, AMEC released two other systems. The Primo Angnova ICP single-chamber etching system offers an independent, technologically advanced ICP etching process solution for 5-nanometer and below logic chip technologies, as well as advanced memory chip manufacturing at equivalent technology nodes. The Primo Domingo high-selectivity etching equipment addresses the process requirements for devices such as GAA, 3D NAND, and DRAM. The high-selectivity etching process applied by this system is one of the most critical processes in three-dimensional device manufacturing.
Naura Technology Group Co., Ltd. introduced its 12-inch Qomola HPD30 hybrid bonding equipment. This system focuses on the extreme demands of chip interconnects for full-range 3D integration applications like SoC, HBM, and Chiplet. It overcomes key process challenges such as damage-free pickup of micron-level ultra-thin chips, nanometer-level ultra-high precision alignment, and void-free, high-quality, stable bonding. The company successfully tackled multiple core technologies, including high-speed multi-axis coordinated control, nanometer-level image recognition, precise global coordinate positioning, adaptability to multi-specification chips, and AI-based real-time sensing and intelligent compensation. By integrating a full set of self-developed high-precision optical imaging systems with advanced algorithms for motion control, global calibration, and end-effector posture adjustment, the equipment achieves a better balance between nanometer-level alignment accuracy and high-speed bonding throughput. Naura has become the first domestic manufacturer to complete customer-side process verification for a D2W hybrid bonding system.
ACM Research (Shanghai) announced a reorganization of its product portfolio and a brand refresh, officially launching a new product combination architecture named "ACM Core Galaxy." Under this new framework, ACM's products are divided into eight independent series, named after the eight planets of the solar system, each corresponding to a specific process step in semiconductor manufacturing. The "Mercury" series consists of coat and develop track systems, first introduced in 2022, which precisely coordinate with lithography processes to ensure production efficiency. A 300 WPH high-throughput KrF model was launched in the third quarter of last year, achieving a late-mover advantage. The "Venus" series comprises plating equipment. Leveraging multi-anode technology, ACM can perform horizontal plating processes on both round and square wafers, covering the entire plating process flow from front-end damascene to mid-end TSV and back-end advanced packaging. Furthermore, the "Earth" series includes cleaning equipment, the "Mars" series encompasses furnace systems, the "Jupiter" series covers wafer-level advanced packaging equipment, the "Saturn" series consists of plasma-enhanced chemical vapor deposition systems, the "Uranus" series includes panel-level packaging equipment, and the "Neptune" series features stress-free polishing equipment.
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