1. Composition of Optical Modules Optical modules are photonic communication devices used for electro-optical signal conversion. Their main components include: (1) **Transmitter Optical Sub-Assembly (TOSA)**: Converts electrical signals to optical signals, consisting of lasers (DFB, VCSEL) and optical coupling components (isolators, modulators). (2) **Receiver Optical Sub-Assembly (ROSA)**: Converts optical signals to electrical signals, composed of detectors (PD, PIN, APD) and transimpedance amplifiers (TIA). (3) **Auxiliary Structures**: Include control circuits (MCU, DSP), optical interfaces (fiber connectors), electrical interfaces (switch connectors), and circuit boards.
2. Overview of Silicon Photonics Technology Silicon photonics leverages silicon-based materials and CMOS processes to integrate multiple optoelectronic components onto a single chip. It is used in silicon photonics modules and CPO switches (silicon photonics engine + switching chip).
2.1 Key Advantages (1) **High Integration**: Traditional optical modules use discrete components assembled separately, while silicon photonics chips achieve high integration with significantly reduced size. (2) **Low Power Consumption**: Electrical interconnects in traditional modules cause signal loss, whereas silicon photonics replaces electrical paths with optical ones, shortening transmission distances. (3) **Cost Efficiency**: Mass production via CMOS processes and lower silicon material costs. (4) **High Speed**: Silicon’s bandgap overcomes electronic interconnect bottlenecks.
2.2 Silicon Photonics Chip Components (1) **Optical Waveguides**: Direct light signals along predefined paths. (2) **Modulators**: Encode electrical signals onto optical carriers by modulating phase/amplitude. (3) **Detectors**: Convert optical signals back to electrical signals. (4) **Couplers**: Integrate external lasers (e.g., CW light sources) into the silicon photonics chip.
2.3 External Light Sources Silicon’s indirect bandgap results in low luminescence efficiency, making external CW light sources the mainstream solution. A CW (Continuous Wave) laser emits stable, continuous beams, with DFB (Distributed Feedback) chips as its core component.
2.4 Workflow (Transmission Link) In silicon photonics modules, the CW light source is placed externally. Laser light enters the chip via a coupler, where modulators encode data onto the optical carrier before transmission through waveguides to the output.
3. CW Light Source/DFB Suppliers - **Source Photonics**: A leading domestic laser chip manufacturer, producing EML, DFB, and silicon photonics CW DFB laser chips. - **Accelink Technologies**: A top-tier optical chip supplier, offering passive (PLC, AWG, VOA, OSW) and active (FP, DFB, EML) chips, including CW DFB lasers. - **Everbright Photonics**: Specializes in high-power laser chips, with products like EML, VCSEL, and silicon photonics CW-DFB.
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