Advanced Micro-Fabrication Equipment Inc. China (AMEC) has officially disclosed an acquisition plan to purchase a 64.69% stake in Hangzhou Zhonggui Electronic Technology Co., Ltd. for 1.576 billion yuan. The transaction will be carried out through a combination of share issuance and cash payment, alongside raising up to 1.5 billion yuan in supporting funds.
As a leading domestic supplier of dry process equipment such as plasma etching and thin film deposition, AMEC’s technology already spans from 65 nanometers to 3 nanometers and more advanced nodes. However, the company has lacked a presence in wet process technology, particularly in chemical mechanical polishing (CMP) equipment for front-end core processes.
Hangzhou Zhonggui is one of the few domestic equipment manufacturers capable of mass-producing 12-inch CMP tools. Its products have been adopted by well-known advanced memory and logic chip manufacturers in China, with performance and technical indicators approaching international advanced levels.
Upon completion of the acquisition, Hangzhou Zhonggui will become a controlled subsidiary of the listed company. AMEC will acquire the 64.69% stake from 41 parties, including Hangzhou Zhongxin Silicon, Ningrong Haichuan, and Lin'an Zhonggui, among others. The total consideration of 1.576 billion yuan will consist of 1.523 billion yuan in stock and 52.5853 million yuan in cash.
After the acquisition, AMEC will emerge as a manufacturer with capabilities across four major front-end process categories: etching, thin film deposition, metrology, and wet processes. This move represents a key step toward offering integrated “dry + wet” process solutions, which can shorten customers’ process debugging cycles and enhance customer loyalty.
Additionally, according to AMEC’s 2025 annual report, the company is currently advancing R&D on more than 20 new types of equipment across six major categories. These include next-generation CCP high-energy plasma etching tools, ICP low-energy plasma etching tools, wafer edge etching systems, LPCVD and ALD thin film equipment, silicon and silicon-germanium epitaxial systems, next-generation plasma source PECVD equipment, CuBS PVD multi-chamber integrated tools, electron beam metrology systems, large panel processing equipment, and several new MOCVD models.
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