Advanced Micro-Fabrication Equipment Inc. China (688012.SH), also known as AMEC, has released its semi-annual report for 2026, revealing continued robust momentum amid surging AI computing power demand and the ongoing expansion of the global semiconductor equipment market. During the first half of the year, the company posted revenue of approximately RMB 6.691 billion, marking a 34.89% year-on-year increase, while its net profit attributable to shareholders, excluding non-recurring items, reached roughly RMB 1.123 billion, up 108.36% from the same period last year.
A standout figure in the report is the net profit attributable to owners of the parent company, which totaled about RMB 2.825 billion in H1 2026, representing a year-on-year surge of approximately 300.22% or an increase of around RMB 2.119 billion compared to the prior year. Meanwhile, AMEC's research and development investment for the period climbed to approximately RMB 2.041 billion, a 36.89% jump year-on-year, accounting for about 30.52% of its total revenue.
Where things stand now, AMEC has successfully developed 54 types of high-end semiconductor equipment, with more than 8,800 reaction chambers currently in mass production across over 220 production lines both domestically and internationally, as of the end of June 2026. Chairman and General Manager Yin Zhiyao highlighted that, since 2012, the company has maintained an average annual sales growth rate of over 35% for 14 consecutive years, achieving per-capita annual sales of RMB 4.5 million.
Looking at the specifics of the H1 2026 report, AMEC's ongoing research projects span six major equipment categories and more than 20 new product lines. These include the next-generation capacitively coupled plasma (CCP) etcher, inductively coupled plasma (ICP) etcher, wafer edge etching equipment, low-pressure chemical vapor deposition (LPCVD) and atomic layer deposition (ALD) thin-film systems, large flat-panel equipment, and several new MOCVD models. During the reporting period, the company also completed the acquisition of a controlling stake in Hangzhou Zhongshui, thereby expanding its coverage into chemical mechanical polishing (CMP) equipment.
As it stands, AMEC's product portfolio now covers approximately 30% of the high-end semiconductor equipment market segment. Yin Zhiyao outlined an ambitious roadmap for the next five years, aiming to cover at least 60% of high-end semiconductor equipment—over 100 product types—through a combination of independent development and external acquisitions. The company also targets covering over 70% of key equipment in the advanced packaging sector, with a long-term goal of becoming a top-tier global semiconductor equipment company by 2035 in terms of scale, product competitiveness, and customer satisfaction.
On the production front, AMEC continues to accelerate its capacity expansion initiatives. On August 1, the company officially inaugurated its headquarters and R&D center in Lingang, Shanghai, a facility with a building area of approximately 100,000 square meters located by Dishui Lake. In parallel, the main structure of its Guangzhou South China headquarters R&D and production base's first phase was topped out in July 2026, with operations slated to commence in 2027. Additionally, the first phase of its Chengdu R&D and production base, serving as the Southwest headquarters, reached its structural peak in August 2026 and is expected to be completed and put into production in 2027.
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