Advanced Micro-Fabrication Equipment Inc. China (688012.SH) announced that it has recently unveiled six new semiconductor equipment products. These systems encompass critical processes including plasma etching, atomic layer deposition, and epitaxy, providing fresh momentum for the company's accelerated transformation into a high-end equipment platform enterprise.
In the etching technology segment, the two newly released products deliver advanced and efficient solutions for customers in ultra-high aspect ratio etching and metal etching applications respectively.
Regarding thin film deposition technology, the company introduced four new products, comprising three atomic layer deposition systems and one epitaxy system.
As semiconductor technology continues to advance and evolve, the demand for plasma etching, atomic layer deposition, and epitaxy technologies maintains strong growth momentum. The launch of these six new semiconductor equipment products covering plasma etching, atomic layer deposition, and epitaxy processes will further address customer requirements, expand the company's product portfolio, and inject new energy into its transformation toward becoming a high-end equipment platform company. This development is expected to generate positive impacts on both the company's future semiconductor equipment market expansion and business growth prospects.
Comments