Montage Technology Co.,Ltd. is a leading global company in interconnect chips. The company's business layout is based on expanding its product matrix through two main product lines. Founded in 2004, Montage Technology is an internationally leading data processing and interconnect chip design company dedicated to providing high-performance, low-power chip solutions for the cloud computing and artificial intelligence sectors. By 2025, the company has established two primary product lines: the Interconnect Chip product line and the Jintide Server Platform product line. In the era of artificial intelligence, the demand for computing power and storage capacity in computers is growing rapidly, and systems require significantly higher data transport capabilities. The company's various high-speed interconnect chip products can effectively enhance a system's data transport power and are poised to play a crucial role in the future AI landscape. The Interconnect Chip product line primarily includes memory interface chips (including MRCD/MDB chips, CKD chips), memory module companion chips, PCIe Retimer chips, MXC chips, and clock chips. The Jintide Server Platform product line mainly consists of Jintide CPUs, data protection and trusted computing accelerator chips, and Hybrid Security DIMMs (HSDIMM). The company's shareholding structure is decentralized, with experienced senior management and core personnel. The company has no controlling shareholder or actual controller, resulting in a relatively dispersed equity structure. As of the third quarter of 2025, Hong Kong Securities Clearing Company Limited is the largest shareholder with a 12.66% stake, while China Electronics Investment Holdings Co., Ltd. is the second-largest shareholder, holding 5.06%. The company's senior management is highly experienced, and its R&D capabilities are robust. The company was co-founded in 2004 by Mr. Yang Chonghe and Stephen Tai. Dr. Yang Chonghe, the Chairman and CEO, previously held positions at companies like National Semiconductor, accumulating extensive experience in design, research and development, and management. The core team largely consists of graduates from prestigious domestic and international universities, boasting rich backgrounds and practical experience in technical R&D, marketing, sales, and engineering management. Since its inception, the company has placed great emphasis on talent cultivation and innovation, having trained hundreds of specialized technical professionals in the fields of high-speed, low-power, and mixed-signal circuit design. Financial analysis indicates strong profitability and rising R&D expenses. The Interconnect Chip product line demonstrates a comprehensive layout, with deepening penetration into downstream application scenarios. Innovation continues in the memory interconnect field, with market share steadily increasing.
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