ASMPT Shares Surge Over 7% in Morning Session on Samsung HBM Equipment Collaboration

Stock News04-14

ASMPT (00522) rose more than 7% during the morning trading session. At the time of writing, the stock was up 6.63%, trading at HK$125.5 with a turnover of HK$236 million. The increase follows news that Samsung Electronics Co., Ltd. is continuing to diversify its supply chain for Thermal Compression (TC) Bonding equipment, a key component for High Bandwidth Memory (HBM). It is reported that Samsung recently completed a demonstration test of HBM thermal compression bonders with ASMPT and has decided to proceed to the next phase of collaboration. According to industry sources on April 13, Samsung plans to launch a Joint Evaluation Project (JEP) with ASMPT for HBM thermal compression bonding machines. Caitong Securities noted that ASMPT aims to capture 35%-40% of the TCB market share, reinforcing its leading position in the industry. In the HBM sector, the company has already received orders from multiple customers for HBM4-12Hi applications, marking an industry-first breakthrough, while steadily advancing the development of HBM4-16Hi technology. Additionally, ASMPT has completed the sale of its AAMI business and plans to divest its NEXX business to focus on advanced packaging. The company has also initiated a strategic review of its SMT business, which may lead to a potential sale, joint venture, spin-off, or public listing in the future.

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At the time of writing, the stock was up 6.63%, trading at HK$125.5 with a turnover of HK$236 million. The increase follows news that Samsung Electronics Co., Ltd. is continuing to diversify its supply chain for Thermal Compression (TC) Bonding equipment, a key component for High Bandwidth Memory (HBM). It is reported that Samsung recently completed a demonstration test of HBM thermal compression bonders with ASMPT and has decided to proceed to the next phase of collaboration. According to industry sources on April 13, Samsung plans to launch a Joint Evaluation Project (JEP) with ASMPT for HBM thermal compression bonding machines. Caitong Securities noted that ASMPT aims to capture 35%-40% of the TCB market share, reinforcing its leading position in the industry. In the HBM sector, the company has already received orders from multiple customers for HBM4-12Hi applications, marking an industry-first breakthrough, while steadily advancing the development of HBM4-16Hi technology. Additionally, ASMPT has completed the sale of its AAMI business and plans to divest its NEXX business to focus on advanced packaging. 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