ASMPT's stock surged 7.35% during intraday trading on Wednesday, following the company's announcement of a strategic divestiture and subsequent positive analyst actions.
The sharp rise comes after ASMPT revealed it will sell its NEXX large-area advanced packaging deposition equipment business to Applied Materials for $120 million in cash. The company stated this move allows it to realize investment value and reallocate resources to focus more intensively on its core back-end semiconductor packaging operations.
Concurrently, CCB International significantly raised its target price for ASMPT from HK$125 to HK$190, while also increasing its adjusted net profit forecasts for 2026 and 2027. Analysts are optimistic about ASMPT's positioning to capitalize on domestic supply chain autonomy trends and its leadership in advanced packaging technologies like thermal compression bonding.
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