PRODUCTIVE TECH (00650) has announced the successful customer acceptance of one of its 12-inch LPCVD furnace systems, which is utilized for LP-SiN thin-film deposition processes. Separately, another 12-inch ALD furnace system is currently undergoing validation at a customer site. This ALD system is designed for ALD-SiN/ALD-SiCN thin-film deposition and is compatible with both Thermal and Plasma modes. The company's advanced semiconductor furnace product line comprises two major equipment platforms: Galilee-LP and Galilee-ALD. These platforms are dedicated to serving the 12-inch logic, DRAM, and 3D NAND markets, covering key thin-film deposition processes for advanced nodes ranging from 65nm to 7nm. They are capable of depositing various materials including SiN, Poly, and TEOS. The market for such equipment is predominantly occupied by overseas suppliers, with a very low rate of domestic production in China. PRODUCTIVE TECH's systems offer superior fill aspect ratios, uniformity, step coverage, and lower contamination levels. While meeting international standards for advanced performance metrics, they also provide higher batch production efficiency and compatibility with multiple process options. Notably, in advanced application development, the company has completed the development of a Low-K ALD SiOCN furnace system for 14/7nm nodes, aimed at meeting the demand for high-performance insulating layers in large-scale integrated circuits. This specific segment is currently monopolized by overseas equipment manufacturers. Furthermore, PRODUCTIVE TECH's semiconductor single-wafer cleaning equipment continues to expand its customer base and mass production experience. Since October 2025, five units of its 6-inch to 12-inch CUBE single-wafer cleaning equipment have successfully passed acceptance at several high-quality customers. These systems are applied in areas such as SiC/power devices/analog-mixed-signal chips, with two of the units being repeat orders. The equipment features specialized capabilities for backside cleaning and etching processes, handling capabilities for ultra-thin wafers, industry-leading Bernoulli transport and wafer edge control technology, and delivers leading productivity through architectural innovation. The Board of Directors, having made all reasonable inquiries, confirms that as of the date of this announcement, the aforementioned customers and their ultimate beneficial owners are independent third parties with no connection to the company or its associates. Moving forward, the company will continue to execute the delivery and acceptance processes for its advanced semiconductor furnace and cleaning equipment, further expand its base of high-quality customers, and fully leverage its technological strengths to drive further breakthroughs in the localization of advanced semiconductor equipment.
Comments