The chip ETF and semiconductor ETF sectors are experiencing a significant surge, driven by major industry shifts. SMIC (688981) is China's largest and most technologically advanced wafer foundry, focusing on NOR Flash, MCU, and other memory-related chip manufacturing services, while also developing DRAM chip foundry technology. The company possesses mass production capabilities for mature processes from 28nm to 14nm, providing wafer manufacturing services for domestic memory chip design firms, positioning it as a core player in the memory chip supply chain. Its capacity expansion project at the Shanghai Lingang base further boosts its memory chip foundry capacity; simultaneously, deep collaboration with domestic memory chip designers is propelling the manufacturing localization of memory chips, securing its critical role in the import substitution process. North Huachuang (002371) is a leading domestic semiconductor equipment manufacturer, providing core equipment such as etching machines, thin-film deposition tools, and cleaning machines for DRAM and NAND Flash manufacturing. The company's etching machines have been deployed in the production lines of Yangtze Memory Technologies (YMTC) and ChangXin Memory Technologies (CXMT), while its thin-film deposition equipment meets the needs for multi-layer film deposition in memory chip manufacturing, with the localization rate of its equipment continuously rising. Concurrently, the company is developing packaging and testing equipment for memory chips; products like bonders and sorters are tailored for memory chip packaging needs, making it a core supplier of upstream equipment in the memory chip industry chain, deeply benefiting from the capacity expansion and technological upgrades of domestic memory chip production lines. AMEC (688012) is a leading domestic etching equipment company, specializing in plasma etching machines for NAND Flash and DRAM chip manufacturing. Its 5nm etching equipment has passed verification by TSMC; furthermore, to meet the demands of 3D NAND manufacturing, it has developed deep silicon etchers capable of high-aspect-ratio etching for memory chips, with products already supplied to domestic manufacturers like YMTC. Additionally, the company is developing etching equipment for memory chip packaging, supporting the implementation of advanced packaging technologies, establishing itself as a core equipment supplier in the memory chip manufacturing segment. Hua Hong Company (688347) is a leading domestic specialty process wafer foundry, focusing on foundry services for non-volatile memory chips like NOR Flash and EEPROM, while also developing niche DRAM chip manufacturing. The company's mature 90nm NOR Flash foundry technology provides manufacturing services for small and medium-sized domestic memory chip designers, holding a certain market share in the consumer electronics and IoT memory chip foundry sectors. Moreover, through capacity expansion at its Hua Hong Wuxi base, it is increasing its memory chip foundry capacity, while collaborating with domestic memory chip designers to develop automotive-grade memory chip foundry processes, expanding into the high-end memory chip market. Shengyi Technology (600183) is a leading domestic CCL (Copper Clad Laminate) manufacturer, providing core materials like high-frequency, high-speed CCL and bonding sheets for memory chip packaging and memory module manufacturing. Its high-frequency CCL products feature low loss and high heat resistance, applicable to PCB manufacturing for memory modules, and are already supplied to module makers like Kingston and ADATA. Simultaneously, the CCL developed for memory chip packaging meets the demands of advanced packaging, enhancing the performance and stability of packaged chips. Furthermore, the company is developing ceramic substrates for memory chips, providing material solutions for thermal management, making it an important supplier of upstream materials in the memory chip industry chain. GigaDevice (603986) is a leading domestic memory chip designer, with core products including NOR Flash, NAND Flash, and DRAM chips, ranking among the top three globally in NOR Flash market share. Its NOR Flash chips cover consumer electronics, industrial control, and automotive electronics; its automotive-grade NOR Flash has passed AEC-Q100 certification and is supplied to domestic automakers. Concurrently, the company collaborates with CXMT on DRAM chip R&D; its mass-produced DDR4 and LPDDR4 chips are used in consumer electronics and industrial control applications. Additionally, the company is developing 3D NAND Flash, gradually completing its memory chip product portfolio, and is a core enterprise in the domestic substitution of memory chips. Shennan Circuits (002916) is a leading domestic PCB manufacturer, providing high-end PCBs and IC substrates for memory modules and memory chip packaging. Its PCBs for memory modules feature high density and high reliability, and are supplied to memory module manufacturers like Samsung and Western Digital. Simultaneously, the IC substrates it developed for memory chip packaging meet the needs of advanced packaging and can be applied to the packaging of DRAM and NAND Flash chips. Furthermore, the company is developing test boards for memory chips, providing hardware support for performance testing, making it a core material supplier in the midstream packaging and module segment of the memory chip industry chain. Montage Technology (688008) is a leading domestic memory interface chip company, with core products including DDR4/DDR5 memory interface chips and memory buffer chips, serving as a key supporting enterprise in the memory chip industry chain. The company holds a leading global market share for its DDR5 memory interface chips, which have been certified by international giants like Intel and Samsung and supplied to mainstream global memory module manufacturers. Concurrently, its PCIe Retimer chips can be used for high-speed interconnection of storage devices, improving data transmission efficiency. Additionally, the company is developing CXL memory expansion chips to meet the large memory demands of the AI era, providing technical support for memory capacity expansion and high-speed transmission. Longsys (301308) is a leading domestic memory module company, with core products including consumer-grade modules (USB drives, memory cards), industrial-grade modules (eMMC, SSD), and automotive-grade modules, positioning it as a core player in downstream memory chip applications. The company has deep collaborations with memory chip OEMs like Samsung and Kioxia, ensuring stable chip procurement channels, while also owning the self-branded "Lexar," which holds significant brand influence in the consumer storage market. Moreover, the company is developing industrial and automotive-grade memory modules; its automotive-grade eMMC has passed AEC-Q100 certification and is supplied to domestic automakers, continuously enhancing its competitiveness in the high-end memory module market. Piotech (688072) is a leading domestic thin-film deposition equipment manufacturer, providing PECVD, ALD, and SACVD equipment for 3D NAND and DRAM manufacturing. Its PECVD equipment has been deployed in YMTC's 3D NAND production lines, capable of depositing multi-layer dielectric and electrode films for memory chips, with performance reaching international advanced levels. Simultaneously, its ALD equipment meets the atomic layer deposition requirements for DRAM chip manufacturing and has passed verification by CXMT. Furthermore, the company is developing thin-film deposition equipment for memory chip packaging, supporting the localization of advanced packaging technologies, establishing itself as a core equipment supplier in the memory chip manufacturing segment. Xi'an Eswin (688783) is a leading domestic company in the semiconductor materials segment, focusing on the R&D and supply of electronic specialty gases and photoresist ancillary materials for memory chip manufacturing. Its electronic specialty gas products include fluorine-based and silicon-based gases, applicable to etching and thin-film deposition processes in memory chip manufacturing, and are supplied to domestic memory chip manufacturers. Concurrently, ancillary materials like photoresist strippers and developers it has developed meet the demands of photolithography processes for memory chips, improving efficiency and yield. Additionally, the company is developing high-purity chemicals for memory chips, providing a one-stop material solution for memory chip manufacturing. ACM Research (Shanghai) (688082) is a leading domestic semiconductor cleaning equipment manufacturer, providing core equipment like single-wafer cleaners and tank cleaners for DRAM and 3D NAND manufacturing. Its SAPS megasonic cleaning technology effectively removes particulate contaminants during memory chip manufacturing and has been deployed in the production lines of YMTC and CXMT. Simultaneously, its electroplating equipment can be applied to the metal wiring stage of memory chips, filling a technological gap domestically in this area. Furthermore, the company is developing cleaning equipment for memory chip packaging, supporting the localization process of advanced memory chip packaging. Shannon Xin Chuang (300475) is a domestic memory chip distribution and module manufacturing company, with core businesses including memory chip distribution and the R&D/manufacturing of industrial-grade memory modules. The company is an authorized distributor for international memory chip OEMs like Samsung, SK Hynix, and Micron, providing memory chip products to domestic consumer electronics and industrial control enterprises. Simultaneously, its self-developed industrial-grade SSDs and eMMC modules feature wide temperature ranges and anti-interference capabilities, used in industrial automation and IoT applications. Moreover, the company is engaged in memory chip import substitution business, collaborating with domestic memory chip designers to promote local chips and expand its distribution and module manufacturing footprint. China Resources Microelectronics (688396) is a leading domestic power semiconductor company, focusing on the R&D and manufacturing of memory chip driver ICs and power management ICs for memory modules. Its memory chip driver ICs can be used in NAND Flash and SSD modules, featuring high integration and low power consumption, and are supplied to domestic memory module manufacturers. Concurrently, the company is developing MOSFETs for memory chips, applicable to power control in storage devices, improving energy efficiency. Additionally, through its wafer manufacturing business, it provides foundry services for small and medium-sized memory chip designers, complementing its layout in the memory chip industry chain. Changchuan Technology (300604) is a leading domestic semiconductor test equipment manufacturer, providing core equipment like testers and sorters for DRAM, NAND Flash, and NOR Flash. Its memory chip testers can perform functional, performance, and reliability testing, and are used in the R&D and mass production stages of domestic memory chip designers. Simultaneously, its sorters enable automated sorting and taping of memory chips, improving testing efficiency. Furthermore, the company is developing advanced testing technologies for next-generation memory chips like DDR5 and 3D NAND, positioning it as a core supplier in the testing segment of the memory chip industry chain. JCET Group (600584) is a leading domestic semiconductor packaging and testing company, providing packaging and testing services for DRAM, NAND Flash, and SSDs, specializing in advanced packaging technologies like SiP, WLCSP, and TSV. The company's memory chip packaging and testing capacity ranks among the top globally; it provides services to international memory chip OEMs like Samsung and Micron, while also offering localized packaging and testing solutions for domestic memory chip designers. Additionally, its developed SSD packaging technology enables high-density integration of memory chips, increasing the capacity and transmission speed of storage devices, giving it strong competitiveness in the field of advanced memory chip packaging. Sharecare Data (300857) is a domestic storage device and IoT device R&D and manufacturing company, focusing on the R&D and production of consumer-grade SSDs and portable storage devices. The company collaborates with memory chip OEMs like Samsung and Kioxia to launch self-branded SSD and USB drive products, while also providing ODM/OEM services for companies like Amazon and Western Digital. Moreover, the company is developing IoT storage devices; its smart camera storage modules and smart home storage devices cater to the storage needs of IoT scenarios. Simultaneously, leveraging its expertise in memory chip application technology, it is expanding into automotive-grade storage device R&D, gradually entering the automotive storage market. Fudan Microelectronics (688385) is a leading domestic FPGA and memory chip designer, focusing on the R&D and manufacturing of specialty memory chips, with core products including radiation-hardened NOR Flash and SRAM chips. Its specialty memory chips feature radiation resistance and high reliability, used in aerospace, military, and other fields, making it a core domestic supplier for specialty memory chips. Concurrently, the company is developing industrial-grade memory chips; its industrial-grade NOR Flash chips are used in industrial control and automotive electronics. Furthermore, through the co-design of FPGAs and memory chips, it provides customers with integrated chip solutions. Unigroup Guoxin Microelectronics (002049) is a leading domestic security chip company, focusing on the R&D and design of secure memory chips and embedded memory chips. Its secure memory chips integrate encryption algorithms and can be used in storage devices for finance, government, and other sectors to ensure data storage security. Simultaneously, its embedded memory chips (eMMC, SPI Flash) are used in smart cards and IoT devices, featuring high security and miniaturization. Additionally, leveraging resources from the Unigroup, the company is involved in DRAM chip localization efforts, participating in the technological R&D and industrialization of domestic memory chips to complete its product portfolio. Dahua Technology (002236) is a leading domestic security company, focusing on the R&D and application of storage devices for security scenarios, with core products including security-specific SSDs, NVR storage modules, and video storage servers. Leveraging its advantage in the security field, its developed security storage devices feature high read/write speeds and large capacities, meeting the high-definition storage demands of video surveillance. Concurrently, the company collaborates with memory chip OEMs to custom-develop chips tailored for security scenarios, improving device compatibility and stability. Moreover, the company is developing AI storage technology, promoting the integration of storage devices and AI algorithms to enhance the analysis and processing efficiency of video data. Zhongke Feichi (688361) is a leading domestic semiconductor metrology and inspection equipment manufacturer, providing wafer defect inspection equipment and film thickness measurement tools for 3D NAND and DRAM manufacturing. Its wafer defect inspection equipment can detect defects in real-time during memory chip manufacturing, improving yield, and has been deployed in YMTC's 3D NAND production lines. Simultaneously, its film thickness measurement equipment accurately measures the thin-film thickness of memory chips, ensuring manufacturing process stability. Furthermore, the company is developing advanced metrology technologies for next-generation memory chip manufacturing needs. Hwatsing Technology (688120) is a leading domestic Chemical Mechanical Polishing (CMP) equipment manufacturer, providing CMP equipment and consumables for 3D NAND and DRAM manufacturing. Its CMP equipment has been deployed in the production lines of YMTC and CXMT, capable of achieving global planarization of memory chip wafers, making it one of the core equipment for 3D NAND manufacturing. Simultaneously, its developed CMP consumables (pads, slurries) have achieved import substitution, reducing the consumable costs of memory chip manufacturing. Additionally, the company is developing CMP equipment for more advanced processes to meet the manufacturing needs of higher-layer 3D NAND chips. Empyrean Technology (301269) is a leading domestic EDA software company, providing full-flow EDA tools for DRAM and 3D NAND design, including software for circuit design, physical verification, and simulation analysis. Its memory chip EDA tools are used in the R&D phases of domestic memory chip designers, enabling efficient design and verification. Concurrently, the company collaborates with domestic memory chip manufacturers to develop EDA tools compatible with local manufacturing processes, promoting co-optimization of design and manufacturing. Furthermore, the company is developing EDA tools for 3D NAND, supporting design innovation for next-generation memory chips. Tongfu Microelectronics (002156) is a leading domestic semiconductor packaging and testing company, providing services for SSD and DRAM modules, specializing in advanced packaging technologies like FCBGA and SiP. The company is a core packaging and testing supplier for AMD's memory chips, while also serving domestic memory chip designers. Additionally, the company is developing advanced packaging for memory chips; its Chiplet packaging technology enables heterogeneous integration, improving performance and capacity. Its Nantong and Xiamen bases have further increased its memory chip packaging and testing capacity, continuously growing its market share in this segment. BIWIN Storage Technology (688525) is a leading domestic memory module company, with core products including consumer-grade SSDs, industrial-grade eMMC, and automotive-grade UFS, while also engaging in memory chip packaging and testing. The company collaborates with YMTC and CXMT to promote domestic memory chips, launching module products based on local chips, gaining a first-mover advantage in the import substitution process. Simultaneously, its automotive-grade memory modules have passed AEC-Q100 certification and are supplied to domestic new energy vehicle makers, gradually increasing its competitiveness in the automotive storage market. Furthermore, the company is developing advanced packaging for memory chips to enhance the integration and performance of its modules. Ingenic Semiconductor (300223) is a leading domestic embedded chip company, focusing on the R&D and design of memory controller chips and embedded memory chips. Its memory controller chips can be used in SSDs and memory modules, featuring high integration and low power consumption, and are supplied to domestic memory module manufacturers. Concurrently, its embedded memory chips (SPI Flash) are used in smart wearables and IoT devices, holding a leading domestic market share. Additionally, through the acquisition of ISSI, the company has entered the DRAM and SRAM chip design business, completing its memory chip product portfolio and enhancing its overall competitiveness. Dosilicon (688110) is a leading domestic memory chip designer, with core products including NAND Flash, NOR Flash, and DRAM chips, making it one of the few domestic companies with full-category memory chip design capabilities. Its memory chips use 40nm and 28nm process technologies, have achieved mass production, and are supplied to domestic consumer electronics and industrial control enterprises. Concurrently, the company collaborates with SMIC and Hua Hong Company to promote the manufacturing localization of domestic memory chips, gradually increasing its market share in the NOR Flash sector. Moreover, the company is developing automotive-grade memory chips, gradually entering the automotive storage market after obtaining AEC-Q100 certification. Deming Li (001309) is a domestic memory module and controller chip design company, with core businesses including memory controller chip design and the R&D/manufacturing of consumer-grade memory modules. Its memory controller chips can be used in USB drives, SD cards, and SSDs, featuring high compatibility and stability, making it an important domestic supplier. Simultaneously, the company launches self-branded memory module products, holding certain brand influence in the consumer electronics market. Moreover, the company is developing industrial-grade memory modules; its industrial-grade SD cards and eMMC modules cater to the needs of industrial automation scenarios, expanding the application fields of its modules. Maxwell Technologies (300751) is a leading domestic photovoltaic equipment company, diversifying into the R&D of laser processing equipment for memory chip manufacturing, with core products including laser etchers and laser cutting equipment. Its laser processing equipment can be used for micro-processing of memory chip wafers, featuring high precision and speed, and has passed verification by domestic memory chip manufacturers. Concurrently, leveraging its expertise from photovoltaic equipment, it is developing laser welding equipment for memory chip packaging, improving efficiency and yield. Furthermore, the company is developing advanced laser processing technologies for memory chips to meet the manufacturing needs of 3D NAND chips. Kema Technology (301175) is a leading domestic semiconductor packaging materials company, providing core materials like conductive adhesives, underfill materials, and thermal interface materials for memory chip packaging. Its conductive adhesive products can be used in the bonding process of memory chips, featuring high conductivity and bond strength, and are supplied to packaging and testing companies like JCET Group and Tongfu Microelectronics. Simultaneously, its developed underfill materials enhance the reliability of memory chip packaging, meeting the demands of advanced packaging. Furthermore, the company is developing thermal interface materials for memory chips, providing material solutions for heat dissipation in storage devices, completing its material layout in the memory chip industry chain. The above content is compiled solely from public information and does not constitute any investment advice; it is for reference only.
Comments