HTSC (SEHK: 06886) has announced that the 2025 Huatai Securities Co., Ltd. Public Offering of Corporate Bonds to Professional Investors (Phase III) (Series I) will settle interest for the period from March 6, 2026, to June 5, 2026, on June 8, 2026.
The bond, abbreviated as '25 Huatai G5', carries a coupon rate of 2.05%. For each lot of these bonds, the principal repayment amount is 1,000 yuan, with an interest payment of 5.167 yuan (tax inclusive).
This bond issue will be delisted on June 8, 2026.
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