Samsung Electronics Takes the Lead by Shipping HBM4E Samples in AI Memory Chip Race

Deep News05-29

Samsung Electronics Co., Ltd. has announced it has begun delivering samples of the industry's most advanced 12-layer HBM4E to customers, securing an early advantage in the competition for artificial intelligence (AI) memory chips.

South Korea's largest company stated that this 12-layer HBM4E offers a 48GB capacity, representing an improvement of over 30% compared to the previous generation. Samsung initiated mass production of HBM4 in February this year, a milestone that underscores the rapid development pace in the high-bandwidth memory market.

HBM chips, which vertically stack multiple layers of DRAM, have become a critical component for AI processors by significantly increasing data transfer speeds while reducing power consumption.

As investments in AI infrastructure accelerate rapidly, market demand for faster and more energy-efficient memory chips continues to surge sharply. Major memory manufacturers are now competing intensely to secure orders for future AI systems.

Samsung's proactive advancement in 12-layer HBM4 may help strengthen its competitive edge against rivals such as SK Hynix. SK Hynix stated in April that its goal is to achieve mass production of HBM4E by 2027 and to provide HBM4E samples to customers in the second half of this year.

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Comments

We need your insight to fill this gap

Leave a comment

1

{"i18n":{"language":"en_US"},"isChannel":false,"data":{"share":"https://ttm.financial/m/news/1142784742?lang=en_US&edition=fundamental","thumbnail":"","is_english":true,"pubTime":"2026-05-29 08:31","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"1142784742","market":"sh","top_or_hot":-1,"title":"Samsung Electronics Takes the Lead by Shipping HBM4E Samples in AI Memory Chip Race","media":"Deep News","content":"<p>Samsung Electronics Co., Ltd. has announced it has begun delivering samples of the industry's most advanced 12-layer HBM4E to customers, securing an early advantage in the competition for artificial intelligence (AI) memory chips.</p>\n<p>South Korea's largest company stated that this 12-layer HBM4E offers a 48GB capacity, representing an improvement of over 30% compared to the previous generation. Samsung initiated mass production of HBM4 in February this year, a milestone that underscores the rapid development pace in the high-bandwidth memory market.</p>\n<p>HBM chips, which vertically stack multiple layers of DRAM, have become a critical component for AI processors by significantly increasing data transfer speeds while reducing power consumption.</p>\n<p>As investments in AI infrastructure accelerate rapidly, market demand for faster and more energy-efficient memory chips continues to surge sharply. Major memory manufacturers are now competing intensely to secure orders for future AI systems.</p>\n<p>Samsung's proactive advancement in 12-layer HBM4 may help strengthen its competitive edge against rivals such as SK Hynix. SK Hynix stated in April that its goal is to achieve mass production of HBM4E by 2027 and to provide HBM4E samples to customers in the second half of this year.</p>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Samsung Electronics Takes the Lead by Shipping HBM4E Samples in AI Memory Chip Race</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nSamsung Electronics Takes the Lead by Shipping HBM4E Samples in AI Memory Chip Race\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1039043262\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/8296859682db4b478146245e72de1922);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Deep News </p>\n<p class=\"h-time\">2026-05-29 08:31</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<p>Samsung Electronics Co., Ltd. has announced it has begun delivering samples of the industry's most advanced 12-layer HBM4E to customers, securing an early advantage in the competition for artificial intelligence (AI) memory chips.</p>\n<p>South Korea's largest company stated that this 12-layer HBM4E offers a 48GB capacity, representing an improvement of over 30% compared to the previous generation. Samsung initiated mass production of HBM4 in February this year, a milestone that underscores the rapid development pace in the high-bandwidth memory market.</p>\n<p>HBM chips, which vertically stack multiple layers of DRAM, have become a critical component for AI processors by significantly increasing data transfer speeds while reducing power consumption.</p>\n<p>As investments in AI infrastructure accelerate rapidly, market demand for faster and more energy-efficient memory chips continues to surge sharply. Major memory manufacturers are now competing intensely to secure orders for future AI systems.</p>\n<p>Samsung's proactive advancement in 12-layer HBM4 may help strengthen its competitive edge against rivals such as SK Hynix. SK Hynix stated in April that its goal is to achieve mass production of HBM4E by 2027 and to provide HBM4E samples to customers in the second half of this year.</p>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK4588","symbol_name":"碎股","start_time":0,"source_url":"","article_id":"1142784742","we_media_id":"1039043262","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=1142784742","pubTimestamp":1780014699,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Deep News","introduction":"Global Stock Market Deep Analysis","home_visible":1,"id":"1039043262","head_image":"https://community-static.tradeup.com/news/8296859682db4b478146245e72de1922"},"summary":"Samsung Electronics Co., Ltd. has announced it has begun delivering samples of the industry's most advanced 12-layer HBM4E to customers, securing an early advantage in the competition for artificial...","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"BK4588":"碎股","BK4550":"红杉资本持仓","SSNLF":"三星电子","BK4585":"ETF&股票定投概念","EEMO":"Invesco S&P Emerging Markets Momentum ETF","AGIX":"通用人工智能 ETF-AGIX","FTXL":"First Trust Nasdaq Semiconductor ETF","ARTY":"ISHARES FUTURE AI & TECH ETF","AIPO":"Defiance AI and Power Infrastructure ETF","DRAM":"Roundhill Memory ETF","BK4170":"电脑硬件、储存设备及电脑周边","IEMG":"iShares Core MSCI Emerging Markets ETF","BK4581":"高盛持仓","BK4543":"AI","BK4504":"桥水持仓","WTAI":"WisdomTree Artificial Intelligence and Innovation Fund","CHAT":"ROUNDHILL GENERATIVE AI & TECHNOLOGY ETF"},"translate_title":"三星电子在AI存储芯片竞赛中率先出货HBM4E样品","themeId":"","isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"SSNLF":1,"ARTY":1,"IEMG":1,"AIPO":1,"AGIX":1,"DRAM":1,"FTXL":1,"WTAI":1,"EEMO":1,"CHAT":1},"content_text":"Samsung Electronics Co., Ltd. has announced it has begun delivering samples of the industry's most advanced 12-layer HBM4E to customers, securing an early advantage in the competition for artificial intelligence (AI) memory chips.\nSouth Korea's largest company stated that this 12-layer HBM4E offers a 48GB capacity, representing an improvement of over 30% compared to the previous generation. Samsung initiated mass production of HBM4 in February this year, a milestone that underscores the rapid development pace in the high-bandwidth memory market.\nHBM chips, which vertically stack multiple layers of DRAM, have become a critical component for AI processors by significantly increasing data transfer speeds while reducing power consumption.\nAs investments in AI infrastructure accelerate rapidly, market demand for faster and more energy-efficient memory chips continues to surge sharply. Major memory manufacturers are now competing intensely to secure orders for future AI systems.\nSamsung's proactive advancement in 12-layer HBM4 may help strengthen its competitive edge against rivals such as SK Hynix. SK Hynix stated in April that its goal is to achieve mass production of HBM4E by 2027 and to provide HBM4E samples to customers in the second half of this year.","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"productRelease","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":1,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":true,"isLaohu8Offline":false,"tenantId":"TBGLOBAL","deviceId":"web-server-community-laohu8-v3","version":"4.44.0","shortVersion":"4.44.0","platform":"web","vendor":"web","appName":"ttm","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/1142784742","isCrawlerRequest":true}