SK Hynix announced on Monday that it will begin mass production of its Small Outline Compression Attached Memory Module 2 (SOCAMM2), specifically designed for NVIDIA's Vera Rubin chip. The SOCAMM2 is a module that adapts low-power memory, previously utilized primarily in mobile products such as smartphones, for server environments. It is intended to serve as the primary memory solution for next-generation artificial intelligence servers.
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