Ping An Bank Successfully Issues 6.5 Billion Yuan Tech Innovation Bonds

Deep News12-19

On December 19, Ping An Bank announced that it has successfully issued 6.5 billion yuan worth of technological innovation bonds (Bond Connect) in the national interbank bond market, with approval from relevant regulatory authorities.

The bonds were recorded on December 17, 2025, and issued on December 19, 2025. The three-year bonds carry a coupon rate pegged to the one-year Loan Prime Rate (LPR) minus 115 basis points, with an initial coupon rate of 1.85%.

Proceeds from the bond issuance will be allocated to technology innovation sectors as outlined in the "Five Key Areas of Finance" statistical framework, including extending tech loans and investing in bonds issued by tech innovation companies, specifically supporting business development in the tech innovation field.

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