Ingenic Semiconductor Co., Ltd. (stock short name: INGENIC) has finalised the offer price for its Hong Kong debut at HK$100.00 per H share, the lower end of the HK$100.00–102.80 indicative range. The transaction will raise gross proceeds of approximately HK$3.13 billion, with estimated net proceeds of HK$3.05 billion after HK$74.10 million in listing expenses.
The Global Offering comprises 31.29 million H shares—3.13 million for the Hong Kong Public Offering (10%) and 28.16 million for the International Offering (90%). An additional 4.69 million shares have been over-allocated and may be covered by a 15% over-allotment option. Upon listing and before any exercise of this option, INGENIC will have 514.95 million shares outstanding.
Investor demand was strong. The Hong Kong Public Offering was 927.37 times subscribed, while the International Offering was 8.43 times covered. Trading in INGENIC’s H shares will commence on 25 August 2026 under the stock code 03223, in board lots of 100 shares.
Eleven cornerstone investors committed to 15.03 million shares—48.05% of the H-share tranche and 2.92% of post-listing share capital—with a six-month lock-up ending 24 February 2027. The largest cornerstone, Emerald Prime, took 4.71 million shares (15.04% of the H-share base). High concentration is notable: the top 10 placees account for 67.65% of the offer, and the top 25 for 93.33%.
Post-offering, public shareholders will hold H shares worth about HK$3.10 billion, meeting the HKEX requirement for a minimum HK$3 billion free float. At least 300 shareholders will hold the stock, and none will control more than 10% of the enlarged share capital.
Dealings in INGENIC’s H shares will become valid at 8:00 a.m. on 25 August 2026, subject to the Global Offering becoming unconditional and the underwriting agreement not being terminated.
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