CICC Announces Plans to Issue Up to RMB 4 Billion in Corporate Bonds

Stock News07-15

CICC (HKEX: 03908) has disclosed its intention to issue a new tranche of corporate bonds.

The company plans to offer the second issuance of its 2026 Science and Technology Innovation Corporate Bonds to professional investors, with the subscription period running from July 17 to July 20, 2026.

The total issuance size for this tranche is capped at RMB 4 billion, and no over-allotment option will be included.

The bonds will be issued in two series, with a par value of RMB 100 per bond, to be sold at par.

According to the announcement, a minimum of 70% of the proceeds raised will be allocated to funding projects within the science and technology innovation sector.

The remaining portion of the funds will be utilized to supplement the company's working capital.

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