Stock Track | ACM Research Stock Soars on Breakthrough Cleaning Tool for Advanced Chips

Stock Track11-07

Shares of ACM Research Inc. (NASDAQ: ACMR) soared 9.66% in pre-market trading on November 7, 2024, following the company's announcement of a major performance breakthrough for its Ultra C Tahoe Cleaning tool used in front-end semiconductor manufacturing.

The upgraded Ultra C Tahoe now achieves the cleaning performance of standalone single-wafer tools on low-to-medium temperature sulfuric peroxide mix (SPM) processes. The tool's patented hybrid architecture combines batch wafer processing and single wafer cleaning chambers, delivering enhanced cleaning performance, high throughput, and process flexibility while reducing chemical consumption by up to 75%.

According to ACM Research President and CEO Dr. David Wang, "With the rise of AI to the forefront of consumers' minds, we expect increased public attention on the environmental impact of semiconductor chip manufacturing. We believe ACM's Ultra C Tahoe is well-positioned to help customers increase production of advanced AI chips, but with a reduced footprint on the environment."

Key features and benefits of the upgraded Ultra C Tahoe include: - Enhanced particle removal capabilities, meeting stringent requirements for advanced node manufacturing - Higher throughput exceeding 200 wafers per hour, comparable to a 12-chamber SPM system - Environmental and cost benefits from reduced sulfuric acid consumption, aligning with sustainability goals - Expanded process capabilities for more than 30 production layers, with additional applications in development - Advanced flexibility with optional configurations for jet spray technology, ACM's patented SAPS/TEBO technologies, and HOT IPA drying technology

The breakthrough positions ACM Research to capture market share within the SPM cleaning market, particularly in middle and low-temperature applications, which the company estimates represents an estimated 20% of the total clean market. The upgraded tool is already in production at several high-volume customer facilities in mainland China, with additional logic and memory customers evaluating the tool for further deliveries through the end of 2024.

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