At today's Xiaomi Xuanjie Technology Exchange Conference, Xiaomi Group Vice President and President of the New Business Division, Zhu Dan, delivered a keynote speech, during which the Xiaomi Xuanjie O100 was officially unveiled.
This marks Xiaomi's first high-bandwidth AI accelerator chip specifically engineered for on-device large models. It employs the industry's first 6nm wafer-level vertical stacking advanced packaging, utilizing Hybrid Bonding technology to achieve a leading 1.4-micron bonding pitch.
The chip delivers an ultra-high bandwidth of 1.22TB/s, which is 16 times greater than that of traditional flagship smartphones, enabling on-device inference speeds of up to 330 tokens per second (TPS).
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