Chip equipment maker ASMPT saw its shares surge as much as 8.7% to a record high on Tuesday, following the release of earnings that surpassed expectations and pointed to sustained demand fueled by artificial intelligence. The company projected second-quarter revenue between $540 million and $600 million, exceeding market expectations of $531.1 million. First-quarter sales reached $507.9 million, also beating forecasts.
After the planned sale of its NEXX business, profit from continuing operations came in at HK$326.4 million, signaling a more focused operational structure going forward.
Growth momentum in its semiconductor solutions segment appears to be accelerating, with group bookings for the quarter reaching $727 million, the highest level in four years. Management indicated that bookings could remain elevated next quarter, supported by ongoing demand in advanced packaging—a critical element in the development of AI chips. Analysts at Citi described the results as "well above expectations," noting that demand for advanced packaging is likely to stay strong, while mainstream semiconductor equipment demand may be entering a recovery phase.
Looking ahead, ASMPT expects structurally strong AI-related demand to support revenue growth in both its semiconductor solutions and surface mount technology segments through 2026, though it acknowledged that broader geopolitical uncertainties remain. The company also stated it is finalizing evaluation plans for its thermal compression bonding tools with a major memory chipmaker. If successfully adopted, the technology could become a standard process in memory chip manufacturing. Although the partner has not been disclosed, this initiative may represent a meaningful long-term catalyst related to next-generation memory chip production.
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