Clarification on Advanced Semiconductor Packaging Status from Bright Power

Deep News07-13

An investor inquired with Shanghai Bright Power Semiconductor Co.,Ltd. (688368.SH) regarding whether the company's semiconductor chip packaging qualifies as advanced, high-end packaging, and requested details on its technical features and advantages.

The company responded, stating that its sixth-generation high-voltage BCD-700V process platform, along with its exclusive and innovative EHSOP12 packaging, has now entered mass production. Additionally, the EMSOP packaging technology is being progressively introduced into mass production. These developments are contributing to a reduction in the company's costs and an improvement in its gross profit margin.

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