XINDE SEMI (07672) made its trading debut, with its shares opening 20.5% higher at HK$10.7 in early trading, according to an announcement. The company priced its shares at HK$8.88 per share, issuing a total of 106,562,500 shares, with each board lot consisting of 500 shares, raising net proceeds of approximately HK$904 million. As of press time, the stock was up 20.5% at HK$10.7, with turnover of HK$89.9624 million.
According to its prospectus, XINDE SEMI is a semiconductor packaging and testing service provider primarily engaged in developing packaging designs, offering customized packaging products, and providing packaging product testing services. According to Frost & Sullivan, in the "post-Moore era" where transistor density growth is approaching its scaling limits, relying on novel semiconductor packaging architectures as a key link connecting chip design and application has become a critical driving force for enhancing chip performance, efficiency, and functional flexibility.
Since its establishment in September 2020, the group has expanded into both traditional and advanced packaging fields, accumulating packaging technology knowledge and possessing mass production capabilities for both traditional and advanced packaging, covering packaging products such as QFN, BGA, LGA, WLP, and 2.5D/3D. The group has established a "Chiplet and Advanced Packaging Technology Platform (CAPiC)" covering all technical branches in both traditional and advanced packaging fields to advance the group's technical knowledge and continuously develop new technologies.
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