HK Stock Movement | TIANYU SEMI (02658) Rises Over 6% Again, Enters Strategic Partnership with Qinghe Chip to Jointly Advance Advanced Bonding Material Process Development

Tianyu Semiconductor (02658) rose over 6% again. As of the time of writing, the stock was up 6.43%, trading at HK$54.65, with a turnover of HK$13.8852 million.

On the news front, Tianyu Semiconductor announced it has entered into a strategic cooperation agreement with Qinghe Chip. Accordingly, both parties agreed to establish a strategic partnership. Leveraging the company's advantages in the silicon carbide material field and Qinghe Chip's capabilities in bonding equipment customization and optimization, they will jointly undertake process development and technological iteration for bonding materials. These materials include bonded silicon carbide (SiC), silicon-on-insulator (SOI), piezoelectric-on-insulator (POI), and extra-large size (12-inch and above) SiC composite heat dissipation substrates.

The Board believes the contracting parties will utilize their respective competitive advantages to establish a mutually beneficial partnership.

By combining the company's industry strength in SiC epitaxial wafers with Qinghe Chip's expertise in bonding integration technology and equipment, the collaboration aims to facilitate the development of advanced bonding material solutions and optimize production processes.

This cooperation is expected to enhance the Group's technical capabilities in large-size composite substrates, ensure equipment stability, and further consolidate the Group's market position.