According to recent overseas media forecasts, Taiwan Semiconductor Manufacturing Company (TSM) has outlined its advanced process development roadmap. Following the scheduled mass production of the 1.4nm process in the second half of 2028, the company's sub-1nm advanced process is expected to enter trial production in 2029. The initial monthly capacity is planned at 5,000 wafers, with Apple likely to be among the first customers for this technology.
Driven by surging demand for AI and high-performance computing, Taiwan Semiconductor Manufacturing's advanced process capacity remains tight. The company's 2nm process entered mass production in the fourth quarter of 2025, with related capacity already booked by key customers through 2028. Orders for the subsequent 1.6nm process have also been confirmed. According to the technology roadmap, the 1.4nm process, codenamed A14, will enter large-scale production in 2028, with performance and energy efficiency expected to improve by approximately 30%.
Apple maintains a close partnership with Taiwan Semiconductor Manufacturing. This year's iPhone 18 series will be the first to feature the company's 2nm A20/A20 Pro chips. Future flagship Apple processors will continue to adopt the 1.4nm advanced process to maintain performance leadership in mobile chips. As a result, market observers widely anticipate that Apple will remain Taiwan Semiconductor Manufacturing's lead partner for sub-1nm process technology.
The sub-1nm process represents the cutting edge of semiconductor technology, where yield control will be critical to successful implementation and profitability. Industry experts believe that Taiwan Semiconductor Manufacturing's ability to consistently overcome yield challenges while expanding advanced process capacity will be a key factor in determining its long-term profitability and leadership in the global foundry market.
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