On January 9th, Saiten Shares responded to investor inquiries on an interactive platform, stating that the development of its MO inspection equipment, patterned wafer defect detection, SiC wafer defect detection, wafer micro-crack detection, wafer film thickness measurement, and wafer void detection equipment is all progressing according to plan. Some of this equipment has already been accepted by clients. The company stated that updates to its official website content are conducted regularly.
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