The supply chain landscape for Taiwan Semiconductor Manufacturing (TSMC)'s next-generation panel-level advanced packaging technology, CoPoS, has now come into view.
According to a report, the first batch of demonstration equipment has been installed at TSMC's subsidiary VisEra's Longtan plant. Close to 30 equipment suppliers from Japan, the US, Germany, and Taiwan have been included in the initial evaluation list, covering the complete process flow from exposure and copper plating to grinding and inspection.
The CoPoS technology replaces traditional circular wafers with larger, rectangular glass panels as the packaging substrate, aiming to meet the growing packaging demands of AI GPUs and high-performance computing (HPC) chips in the coming years. TSMC's Chairman C.C. Wei first mentioned this technology during an earnings call in April 2026, and Taiwan's Intellectual Property Office recently announced that TSMC has applied for the "TSMC-COPoS" trademark.
Supply chain sources indicate that the mass production timeline for CoPoS could potentially be achieved by 2029, ahead of previous market expectations for full-scale production in 2030. However, most equipment suppliers are still in the demonstration phase. The process from initial verification to securing formal purchase qualification typically takes about a year and a half, and competition is fierce. Even if demonstration equipment passes evaluation, it does not guarantee final mass production orders.
Initial Equipment List Spans Six Major Process Areas
The disclosed equipment roster for the first CoPoS supply wave covers six key areas: exposure and coating, metallization and copper plating, grinding and laser processing, wet processes and heat treatment, molding and reflow, and measurement and inspection.
In exposure and coating, TSMC has assembled a comprehensive lineup, including Japan's Canon with its FPA-5525iV LF2 exposure tool, Germany's SUSS MicroTec with its DSC310s Gen4 exposure machine and ACS310 Gen2 coater/developer platform, Japan's Tokyo Electron (TEL) with the LITHIUS Pro SQ3, SCREEN with the LM-3000, and Taiwan's Scientech with panel-level debonding layer coating equipment.
For metallization and copper plating, equipment specifications have been upgraded as CoPoS requires larger-sized redistribution layers (RDL) and finer line processes. US-based Applied Materials and KLA, along with Taiwan's Leading Precision, are on the list. Lam Research is supplying the SABRE 3D FP for copper plating and the Quartos FP for UBM etching, reportedly securing demo equipment orders for the pilot line ahead of other major US competitors.
In grinding and laser processing, Japan's DISCO has secured nearly all related orders. Nitto Denko is supplying Frame Mount and UV Erasing equipment, while LINTEC handles Lamination and De-taping processes. Kulicke & Soffa's APTURA WP and ASMPT's Firebird XQ are included for fluxless die bonding equipment. Japan's Shibaura is providing its TFC-6600-WB and TFC-6500-WB systems, and Taiwan's All Ring is listed for underfill dispensing equipment.
For wet processes and heat treatment, Taiwan's Grand Process Technology (GPTC) and Scientech are key beneficiaries. AblePrint's BPO-60A, Kokusai Electric's 450A and 450A-HT, and Csun Mfg.'s HOMOL-AP31, HP-AP31, and CSL-A300PL equipment are included for baking and heat treatment processes. Molding equipment comes from Japan's TOWA and APIC YAMADA, while reflow equipment is supplied by SEMIgear and Heller.
Glass Substrate Drives Inspection Demand, Taiwanese Firms Secure Key Roles
The adoption of glass substrates in CoPoS has significantly increased the importance of measurement and inspection, creating an opportunity for Taiwanese equipment makers to reposition themselves.
Taiwan's V5 Tech (Beryllium) has become a focal point in the initial supply chain, with its V5P310 Pro Glass AXI inspection tool and V5300 Macro AOI system both making the list. Favite is responsible for overlay measurement, while Weike Semi is involved in 3D profile and dimensional measurement. Mirle Automation, in collaboration with Japan's KOBELCO, is supplying bevel inspection and bonding shift measurement equipment. Other Taiwanese companies on the list include Chroma ATE, Gudeng Precision, Gallant Micro, Ta Liang, YaYa Tech, Nivek, and Semtek Corp.
Industry sources note that CoPoS is not simply an enlarged version of the CoWoS process. It is a new packaging production line fundamentally redesigned around square panels, encompassing glass substrates, panel-level RDL, large-format exposure, high-precision die placement, ultra-low warpage control, and a new measurement mechanism, making it significantly different from existing CoWoS lines. This technological barrier, in turn, provides an opportunity for equipment suppliers previously unable to enter the CoWoS supply chain to compete anew.
Supply chain sources emphasize that CoPoS equipment often involves special specifications, with unit prices typically higher than existing equipment platforms. However, as the process is still in the certification phase, final pricing will depend on customer requirements. Demonstration equipment is usually provided free of charge for customer validation. The process from equipment delivery to completing demo verification takes about three months, with the subsequent mass production certification cycle being even longer, meaning the overall competitive landscape remains highly uncertain.
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