SanDisk Corp.'s significant earnings growth and its addition to the Nasdaq 100 index underscore the indispensable role of storage chips in the artificial intelligence era. This development aligns with strengthening industry trends and capital market expectations.
Shennan Circuits Co., Ltd. (002916), headquartered in Shenzhen, Guangdong, is a core leader in high-end printed circuit boards and packaging substrates in China. Its main businesses include printed circuit boards, packaging substrates, and electronic assembly. The company has deep expertise in the storage chip supply chain, providing key substrates for the packaging process, such as eMMC storage chip packaging substrates, MEMS packaging substrates, RF module packaging substrates, and high-speed communication packaging substrates. These products are crucial base materials for the storage chip packaging stage, directly supporting the capacity expansion and technological upgrades of domestic storage wafer fabs and serving as a vital link in the localization of the supply chain.
Yuanlin Co., Ltd. (605303), based in Hangzhou, Zhejiang, traditionally focuses on landscape engineering and ecological environment management and restoration. According to public information, its affiliated company, Hualan Micro, is a component provider in the domestic data storage sector, specializing in solid-state storage controller chips and storage modules. These controller chips support various high-speed interfaces like SD/MMC/eMMC, USB, PATA, SATA, SAS, and PCIe, meeting the needs of mobile storage and solid-state drives, thereby providing core control chip support for domestic storage chips in consumer electronics and embedded applications.
Shengyi Technology Co., Ltd. (600183), headquartered in Dongguan, Guangdong, is a global leader in copper-clad laminates and electronic base materials. Its main products include copper-clad laminates, bonding sheets, and high-frequency, high-speed materials. In the storage chip sector, the company's products are deeply integrated, with its packaging-grade copper-clad laminate technology already being used in bulk for storage chips and related fields. Additionally, the company began developing high-frequency, high-speed packaging materials as early as 2005, breaking through foreign technological barriers to create high-speed products compatible with advanced packaging processes like FC-CSP and FC-BGA. These products effectively meet the stringent requirements for low dielectric constant and high-speed transmission materials in AI servers and high-end storage chips.
Xiechuang Data Co., Ltd. (300857), based in Shenzhen, Guangdong, provides IoT smart data operation services and related terminal product manufacturing. Regarding its storage chip business, disclosures from an interactive platform in May 2023 indicate the company is engaged in both procurement and in-house R&D in the storage chip sector and is applying for relevant technology patents. Its business spans the entire chain of IoT data generation, transmission, and storage. Breakthroughs in its in-house R&D could enable entry into the storage chip market for IoT terminal devices, benefiting from the growing storage demand driven by the proliferation of IoT devices.
Guidian Co., Ltd. (301629), headquartered in Shenzhen, Guangdong, specializes in the R&D and manufacturing of semiconductor test probes, test fixtures, and automated test equipment. According to its prospectus, the company has significant potential for import substitution in the integrated circuit field, with a core focus on supporting equipment for storage chip manufacturing. Its DEMO equipment has been sent to leading domestic storage chip manufacturers like Yangtze Memory Technologies for trial production validation, marking the entry of domestic semiconductor test equipment into the supply chains of major domestic storage wafer fabs and representing a key step in equipment localization.
Kema Technology Co., Ltd. (301611), based in Shenzhen, Guangdong, engages in the R&D, production, and sales of advanced ceramic materials and components. In the storage chip supply chain, its advanced ceramic materials are primarily used in front-end wafer fabrication process equipment, including key steps like etching, thin-film deposition, ion implantation, lithography, and oxidation diffusion involved in storage chip manufacturing. To date, the company's 12-inch electrostatic chucks have completed validation and achieved small-scale mass production, while its 12-inch multi-zone heated electrostatic chucks have been developed and are undergoing validation, positioning the company as a key supplier of critical supporting materials for the localization of high-end manufacturing equipment for domestic storage chips.
Jiangbolong Co., Ltd. (301308), headquartered in Shenzhen, Guangdong, is a leading domestic storage chip design and module manufacturer, specializing in flash memory storage chips and module products. Its product portfolio includes DDR4 and DDR5 memory modules, LPDDR series mobile memory, and it possesses the rare capability to design both controller chips and small-capacity storage chips. The company's products are widely used in smartphones, automotive electronics, data centers, and other fields. It has significant collaborations within the ChangXin Memory Technologies and Yangtze Memory Technologies supply chains, making it a core enterprise in the downstream application and module manufacturing of domestic storage chips.
Han's Laser Technology Co., Ltd. (002008), based in Shenzhen, Guangdong, is a global leader in laser processing equipment. In the semiconductor sector, its subsidiary Han's Semiconductor focuses on the R&D and production of semiconductor manufacturing equipment, with product lines covering key processes like laser grooving, cutting, drilling, and internal modification of wafers. These processes are crucial upstream steps in storage chip manufacturing, directly impacting wafer processing precision and efficiency. Leveraging its deep expertise in laser technology, the company is gradually entering the high-end semiconductor equipment market, providing core manufacturing equipment support for the domestic storage chip and integrated circuit industries.
Dawei Co., Ltd. (002213), headquartered in Shenzhen, Guangdong, primarily operates in automotive electronics and security electronics. According to an August 2024 announcement and an April 2025 interactive disclosure, its wholly-owned subsidiary, Shenzhen Dawei Chuangxin Microelectronics Technology Co., Ltd., offers products covering both NAND and DRAM storage series, including DDR3, DDR4, LPDDR4X commercial/wide-temperature grade, DDR5 DRAM products, as well as eMMC and BGA Nand Flash products. Dawei Chuangxin's products are applicable in data centers, in-vehicle infotainment, consumer electronics, and other fields, serving as a key platform for the company's expansion into the semiconductor storage sector and marking its strategic shift towards the high-growth semiconductor industry.
Yingxin Development Co., Ltd. (000620), based in Guangzhou, Guangdong, traditionally focuses on cultural tourism and hotel services. According to an October 2025 announcement, the company plans to acquire an 81.8091% stake in Guangdong Changxing Semiconductor Technology Co., Ltd. through a cash payment, thereby entering the semiconductor storage chip sector. The target, Changxing Semiconductor, is a high-tech enterprise specializing in memory chip packaging and testing and storage module manufacturing. It possesses wafer testing and repair technologies, along with capabilities for 8-layer die stacking packaging and the manufacturing of BGA, SiP, and DRAM memory modules. This acquisition is a critical step in the company's business transformation, aimed at capturing the growth opportunities presented by the expansion of the domestic storage chip industry.
Kexiang Co., Ltd. (300903), located in Huizhou, Guangdong, primarily engages in the R&D, production, and sales of high-density printed circuit boards, with products widely used in consumer electronics, communication equipment, and automotive electronics. Leveraging its long-term technical expertise in high-density PCBs, the company has the capability for small-batch production of IC substrates, including MEMS packaging substrates and storage chip packaging substrates, primarily for applications like sensors and memory in small electronic devices. Amid the ongoing trend of storage chip localization, its packaging substrate business can provide domestic support for downstream storage chip manufacturers, meeting the substrate needs for mid-to-low-end storage chip packaging and enhancing the overall self-sufficiency and stability of the domestic storage supply chain.
Shengshi Technology Co., Ltd. (002990), based in Shenzhen, Guangdong, specializes in the R&D, production, and sales of intelligent security systems, smart port solutions, and related intelligent equipment, with strong project implementation and system integration capabilities. The company has entered the storage and computing chip sector by investing in Suzhou Yizhu Intelligent Technology Co., Ltd., which focuses on the R&D of novel ReRAM memory and compute-in-memory architectures. Its products target high-computing-power scenarios like data centers, cloud computing, servers, and autonomous driving. As AI models and intelligent terminals drive increased demand for high-performance storage, compute-in-memory chips are poised to become a key next-generation technology. This strategic move allows the company to enter the cutting-edge storage market, potentially gaining new growth opportunities from the AI hardware upgrade wave.
Taiji Industry Co., Ltd. (600667), headquartered in Wuxi, Jiangsu, operates in semiconductor packaging and testing, engineering technical services, and traditional chemical fiber businesses, with semiconductors being a key strategic growth area. Its subsidiary, Taiji Semiconductor, has a strong presence in storage chip packaging and testing, offering full coverage from traditional to advanced packaging for DRAM and NAND Flash. It provides comprehensive packaging and testing services for domestic and international storage chip design companies and wafer fabs. Against the backdrop of rapid domestic storage capacity expansion, the company's packaging and testing capacity continues to increase, securing more orders from domestic storage chip manufacturers and positioning it as a key player in the packaging and testing segment of the domestic storage chip supply chain, strongly supporting the industry's localization efforts.
Shannon Xinchuang Co., Ltd. (300475), based in Shenzhen, Guangdong, engages in electronic component distribution, IoT module R&D, and the design and production of enterprise-grade storage products. As a major distributor for SK Hynix, the company holds authorization for HBM high-bandwidth memory products. It has also established a controlled subsidiary in partnership with industry leaders, focusing on the R&D, production, and sales of enterprise-grade SSDs. The construction of AI servers and data centers is driving significant growth in demand for HBM and high-speed storage. Leveraging its upstream resource advantages and in-house product development, the company is deeply embedded in the high-end storage sector, directly benefiting from the global AI infrastructure investment boom, with its business scale and profitability expected to rise alongside industry prosperity.
GigaDevice Semiconductor Inc. (603986), headquartered in Beijing, specializes in the R&D, design, and sales of memory, microcontrollers, and sensors, and is a significant global fabless Flash supplier. Its comprehensive memory product portfolio includes NOR Flash, NAND Flash, and DRAM. The company also distributes ChangXin Memory Technologies' DRAM products and achieved mass production of its first low-power SRAM product in 2021. Against the backdrop of recovering demand in consumer electronics, industrial control, IoT, and AI terminals, the company's diverse memory chip offerings are developing synergistically, securing an important position in the domestic storage substitution process and providing stable, reliable memory chip solutions for downstream terminal manufacturers.
Qiangyi Co., Ltd. (688809), based in Shenzhen, Guangdong, focuses on the R&D, production, and sales of semiconductor test equipment and core components, specializing in front-end test processes. The company is actively expanding into the storage chip testing field, having completed validation for 2.5D MEMS probe cards for HBM and NOR Flash, and is progressing with the development and validation of 2.5D MEMS probe cards for DRAM and NAND Flash. As advanced storage chip processes continue to evolve, requiring higher precision and stability from test equipment, the company's relevant products can meet the testing needs of high-end storage chips, assisting domestic storage chip manufacturers in improving R&D and mass production efficiency and promoting import substitution in the semiconductor test equipment sector.
Semi-ACME Co., Ltd. (301095), listed on the ChiNext board, specializes in the R&D, sales, and technical services of IC EDA software and wafer electrical test equipment, focusing on chip yield improvement and manufacturing process optimization. Its self-developed yield management system is widely used by hundreds of design houses, wafer fabs, and packaging and testing plants. The latest version includes a new Fail Bit Map analysis module specifically designed for precise analysis of failure points in storage chips, helping manufacturers quickly identify defect causes, optimize manufacturing processes, and improve product yield. This module supports the analysis of various storage chips like DRAM and NAND, as well as SOC memory modules, directly serving the R&D and mass production stages of storage chips and acting as a crucial tool for improving the yield of domestic storage chips.
Do-Fluoride New Materials Co., Ltd. (002407), headquartered in Jiaozuo, Henan, engages in the R&D and production of fluorochemical products, new energy materials, and semiconductor-grade electronic chemicals, holding strong competitiveness in the high-end electronic chemicals field. The company has an annual production capacity of 20,000 tons of semiconductor-grade hydrofluoric acid, with purity meeting advanced process requirements. It stably supplies leading global semiconductor and storage chip companies, including TSMC, Hefei ChangXin, Wuhan Xinxin, and Samsung Electronics. Semiconductor-grade hydrofluoric acid is a key cleaning and etching material in the storage chip manufacturing process. With its stable product supply and high-quality customer resources, the company is deeply aligned with the expansion rhythm of domestic storage capacity, becoming a key supporting enterprise in the upstream materials segment of the storage chip industry.
Dinglong Co., Ltd. (300054), based in Wuhan, Hubei, operates in two main sectors: printing and copying consumables and semiconductor chip materials, with increasing investment in the semiconductor materials field in recent years. The company focuses on key consumables like CMP polishing pads, slurries, cleaning solutions, and high-end wafer photoresists. These products are indispensable key materials in the storage chip manufacturing process, directly applied in the production of various storage chips like DRAM and NAND. Currently, its CMP polishing series products have achieved large-scale sales to mainstream domestic wafer manufacturers, forming strong synergies with companies like Yangtze Memory Technologies and ChangXin Memory Technologies. It provides critical material support for the domestic storage chip supply chain, enhancing the industry's self-sufficiency and controllability.
Jingce Electronic Co., Ltd. (300567), headquartered in Wuhan, Hubei, specializes in the R&D, production, and sales of semiconductor inspection equipment, display inspection equipment, and intelligent manufacturing systems, and is a core enterprise in China's semiconductor inspection field. In the storage chip sector, according to a March 7, 2024, interactive disclosure, the company has established good cooperative relationships with numerous customers, including Yangtze Memory Technologies and Hefei ChangXin, providing key inspection equipment support for domestic storage chip manufacturers. This aids in improving storage chip yield and process optimization, positioning the company as an important supporting enterprise in the inspection segment of the storage chip supply chain.
Jac Technology Co., Ltd. (002409), headquartered in Yixing, Jiangsu, engages in semiconductor materials, electronic special gases, and LNG insulation panels, and is a leading global supplier of semiconductor precursors. In the storage chip field, according to its 2022 annual report, the company's products can meet the mass production supply requirements for the world's most advanced storage chip process nodes, such as 1b for DRAM, 200+ layers for NAND, and 3nm for logic chips. It provides core electronic materials for storage chip manufacturing, deeply integrated with the upgrade of global advanced storage chip processes, and serves as a key supplier in the upstream materials segment of the storage chip industry.
Xianggang Technology Co., Ltd. (603499), headquartered in Shanghai, operates in packaging and printing, cosmetics production, and semiconductor-related investment businesses. In the storage chip sector, according to an August 13, 2025, interactive disclosure, the company holds a 13.1944% stake in Kimtigo. Kimtigo, a national high-tech enterprise, specializes in data storage and is a comprehensive provider of fast storage solutions integrating R&D, production, and marketing of its own brand products. Through this investment, the company enters the downstream module and solutions track of the storage chip market, sharing in the growth dividends of the storage industry.
Xiandao Jidian Co., Ltd. (600641), headquartered in Shanghai, engages in real estate development and semiconductor equipment manufacturing. Its subsidiary, Kingstone, is a core enterprise in domestic ion implanter technology. In the storage chip field, according to a June 13, 2023, interactive disclosure, Kingstone's products cover logic, storage, and power semiconductor applications. It is the first domestic equipment company to have its high-current and high-energy ion implanters for integrated circuits verified and accepted, possessing core models like high-energy ion implanters and ultra-low temperature ion implanters. It provides key front-end equipment for storage chip manufacturing, promoting the localization of equipment for domestic storage chips.
Naura Technology Group Co., Ltd. (002371), headquartered in Beijing, specializes in the R&D, production, and sales of semiconductor equipment and vacuum equipment, and is a leading domestic semiconductor equipment manufacturer. In the storage chip field, according to its 2023 annual report, the company's self-developed 12-inch atmospheric pressure silicon epitaxial equipment achieves full coverage for logic chips, storage chips, power devices, and specialty processes. All models have been successfully mass-produced and become baseline products for customers, providing core equipment support for storage chip manufacturing. It deeply serves domestic storage wafer fabs like Yangtze Memory Technologies, positioning itself as a core enterprise in the equipment segment of the storage chip supply chain.
Tramy New Materials Co., Ltd. (603650), headquartered in Shanghai, engages in special rubber materials, semiconductor photoresists, and electronic chemicals, and is a leading domestic semiconductor photoresist manufacturer. In the storage chip field, according to a March 23, 2023, interactive disclosure, the company's semiconductor photoresist products include G/I-line and KrF photoresists. Its domestic customers include dozens of companies such as SMIC, Huahong Group, Yangtze Memory Technologies, and ChangXin Memory Technologies. It provides key lithography materials for storage chip manufacturing, supporting the localization of lithography processes for domestic storage chips.
Shanghai Xinyang Co., Ltd. (300236), headquartered in Shanghai, specializes in the R&D, production, and sales of semiconductor electronic chemicals, electroplating solutions, and additives, and is a core enterprise in domestic semiconductor materials. In the storage chip field, according to a July 17, 2023, interactive disclosure, the company's electroplating solutions and additive products can be used by memory chip manufacturers. Its self-developed etching solutions for memory chips have been mass-produced and sold. Both Yangtze Memory Technologies and ChangXin Memory Technologies are important strategic customers, and their capacity expansions positively impact the company's business, deeply aligning it with the expansion of domestic storage chip production capacity.
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